公开(公告)号：US10431887B2

公开(公告)日：2019-10-01

申请号：US15807094

申请日：2017-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Young Kim ,  Sang-Seob Kim ,  Min Park ,  Jung-Je Bang ,  Beom-Ju Kim ,  Jae-Heung Ye ,  Yong-Won Lee ,  Jung-Sik Park

IPC: H05K7/00 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00 ,  H05K1/11 ,  H05K1/14 ,  G06F3/041 ,  H01Q1/48 ,  H01Q1/22 ,  H01L23/552 ,  H04M1/02 ,  H01Q1/24 ,  G06F3/044 ,  H04M1/03 ,  H01Q9/42 ,  H05K1/02

Abstract: An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.