公开(公告)号：US09888586B2

公开(公告)日：2018-02-06

申请号：US15405256

申请日：2017-01-12

Applicant: Samsung Electronics Co., Ltd

Inventor： Jung-Je Bang ,  Yong-Won Lee ,  Jeong-Ung Kim ,  Jae-Heung Ye

IPC: H05K9/00 ,  H05K5/00 ,  H01R4/02 ,  H05K1/18

CPC classification number: H05K5/0004 ,  H01R4/02 ,  H05K1/18 ,  H05K5/0086 ,  H05K9/0007 ,  H05K9/0028

Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

公开(公告)号：US09640417B2

公开(公告)日：2017-05-02

申请号：US14494669

申请日：2014-09-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam-Su Yuk ,  Kyung-Won Kang ,  Tae-Hun Kim ,  Se-Ho Park ,  Juno Park ,  Yong-Won Lee

IPC: H01L21/673 ,  H01L21/687 ,  H01L21/677

CPC classification number: H01L21/67379 ,  H01L21/6773 ,  H01L21/67775 ,  H01L21/67781 ,  H01L21/68707

Abstract: A cassette transfer apparatus includes a holding unit configured to hold a cassette having a wafer loaded therein, the cassette having at least one stepped part, and the holding unit including at least one holding part configured to have the at least one stepped part placed thereon. The at least one stepped part includes a pair of stepped parts provided at opposite surfaces of the cassette, and the at least one holding part includes a pair of holding parts that extends back and forth and is configured to have the pair of stepped parts placed thereon.

公开(公告)号：US10431887B2

公开(公告)日：2019-10-01

申请号：US15807094

申请日：2017-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Young Kim ,  Sang-Seob Kim ,  Min Park ,  Jung-Je Bang ,  Beom-Ju Kim ,  Jae-Heung Ye ,  Yong-Won Lee ,  Jung-Sik Park

IPC: H05K7/00 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00 ,  H05K1/11 ,  H05K1/14 ,  G06F3/041 ,  H01Q1/48 ,  H01Q1/22 ,  H01L23/552 ,  H04M1/02 ,  H01Q1/24 ,  G06F3/044 ,  H04M1/03 ,  H01Q9/42 ,  H05K1/02

Abstract: An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.

公开(公告)号：US10542646B2

公开(公告)日：2020-01-21

申请号：US15937646

申请日：2018-03-27

Applicant: Samsung Electronics Co., Ltd

Inventor： Chang-Joon Lee ,  Yong-Won Lee ,  Hyun-Tae Jang

IPC: H05K1/09 ,  H05K9/00 ,  H05K3/30 ,  H05K1/18 ,  H05K1/03 ,  H05K1/05 ,  H05K3/34 ,  B32B15/01 ,  B23K35/02 ,  B23K35/26 ,  C22C9/04 ,  C22C38/40 ,  C22C9/06 ,  H05K1/02 ,  B23K101/42

Abstract: According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.

公开(公告)号：US20170202093A1

公开(公告)日：2017-07-13

申请号：US15405256

申请日：2017-01-12

Applicant: Samsung Electronics Co., Ltd

Inventor： Jung-Je Bang ,  Yong-Won Lee ,  Jeong-Ung Kim ,  Jae-Heung Ye

IPC: H05K5/00 ,  H05K9/00 ,  H01R4/02 ,  H05K1/18

CPC classification number: H05K5/0004 ,  H01R4/02 ,  H05K1/18 ,  H05K5/0086 ,  H05K9/0007 ,  H05K9/0028

Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.