公开(公告)号：US08901598B2

公开(公告)日：2014-12-02

申请号：US13856716

申请日：2013-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-sik Hwang ,  Jun-youn Kim ,  Su-hee Chae

IPC: H01L33/00 ,  H01L33/12

CPC classification number: H01L33/0079 ,  H01L33/12

Abstract: A light emitting device (LED) includes a stress control layer having a compressive stress on a substrate, a bonding layer on the stress control layer, a semiconductor layer on the bonding layer and including an active region for emitting light on the bonding layer, a first electrode on a lower surface of the substrate, and a second electrode on the semiconductor layer. The compressive stress of the stress control layer is between about 1 and about 20 GPa.

Abstract translation: 发光器件（LED）包括在基板上具有压应力的应力控制层，应力控制层上的接合层，接合层上的半导体层，并且包括用于在接合层上发光的有源区， 在基板的下表面上的第一电极和在半导体层上的第二电极。 应力控制层的压缩应力在约1和约20GPa之间。