MEMORY MODULES INCLUDING A MIRRORING CIRCUIT AND METHODS OF OPERATING THE SAME

    公开(公告)号:US20200335139A1

    公开(公告)日:2020-10-22

    申请号:US16733803

    申请日:2020-01-03

    Abstract: A memory module is provided including a plurality of semiconductor memory devices mounted on a circuit board. A control device is mounted on the circuit board and configured to receive a command signal, an address signal, and a clock signal and to provide the command signal, the address signal, and the clock signal to the plurality of semiconductor memory devices. A first group of the semiconductor memory devices is disposed between the control device and a first edge portion of the circuit board, and a second group of the semiconductor memory devices is disposed between the control device and a second edge portion of the circuit board. The control device is configured to transmit the address signal to the first group of the semiconductor memory devices and the second group of the semiconductor memory devices through a first transmission line and a second transmission line, respectively. The first transmission line and the second transmission line are physically symmetric with respect to an axis intersecting the control device.

    POWER MANAGEMENT INTEGRATED CIRCUITS AND SEMICONDUCTOR MEMORY MODULES INCLUDING POWER MANAGEMENT INTEGRATED CIRCUITS

    公开(公告)号:US20200335141A1

    公开(公告)日:2020-10-22

    申请号:US16731908

    申请日:2019-12-31

    Abstract: A power management integrated circuit includes first pads, second pads, a third pad, and a fourth pad that are configured to be connected with an external device, a regulation block that receives first voltages from the first pads, converts the first voltages to second voltages, and outputs the second voltages to the second pads, a communication block that receives a command through the third pad and outputs an internal information request received together with the command responsive to the command, and a logic block that controls an operation of the regulation block, receives the internal information request from the communication block, and outputs internal state information to the fourth pad based on the internal information request.

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