公开(公告)号：US20140197038A1

公开(公告)日：2014-07-17

申请号：US14155776

申请日：2014-01-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myung-Beom PARK ,  Yun-Deok KANG ,  Ki-Hyeon KIM ,  Youn-Joung CHO ,  Jung-Sik CHOI

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C25D5/04 ,  C25D5/08 ,  C25D17/001 ,  C25D17/06 ,  C25D21/14

Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.

Abstract translation: 电镀液包括水溶性铜盐，硫化物离子和氯离子的水性电解质溶液，包含具有硫（S）的有机材料，促进铜（Cu）还原的促进剂的促进剂，包含聚醚化合物的抑制剂，抑制剂 选择性地抑制铜还原，以及包含在电解质水溶液中溶解成正离子的具有氮的水溶性聚合物的整平剂。