公开(公告)号：US20150162195A1

公开(公告)日：2015-06-11

申请号：US14511191

申请日：2014-10-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun Won HAN ,  Su-Jin KWON ,  Hye-Ryun KIM ,  Jae-Hyun KIM ,  Jung-Sik CHOI

IPC: H01L21/033 ,  H01L21/311 ,  H01L21/768 ,  C08L53/00

CPC classification number: H01L21/0337 ,  C08F297/026 ,  C08L53/00 ,  G03F7/0002 ,  H01L21/0332 ,  H01L21/31144 ,  H01L21/76816

Abstract: In a method of manufacturing a semiconductor device, a blend solution that includes a block copolymer and an adsorbent is prepared. The block copolymer is synthesized by a copolymerization between a first polymer unit and a second polymer unit having a hydrophilicity greater than that of the first polymer unit. The adsorbent on which the block copolymer is adsorbed is extracted. The block copolymer is separated from the adsorbent. The block copolymer is collected. The block copolymer may be used to form a mask on an object layer on a substrate and the mask used to etch the object layer.

Abstract translation: 在制造半导体器件的方法中，制备包括嵌段共聚物和吸附剂的共混溶液。 嵌段共聚物通过第一聚合物单元和亲水性大于第一聚合物单元的第二聚合物单元之间的共聚合成。 萃取其上吸附嵌段共聚物的吸附剂。 从吸附剂中分离出嵌段共聚物。 收集嵌段共聚物。 嵌段共聚物可以用于在基材上的物体层上形成掩模，并且掩模用于蚀刻物体层。

公开(公告)号：US20150115436A1

公开(公告)日：2015-04-30

申请号：US14308837

申请日：2014-06-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Won HAN ,  Hye-Reun KIM ,  Hoon HAN ,  Dong-Jun LEE ,  Jung-Sik CHOI

IPC: H01L23/538 ,  H01L21/768 ,  H01L23/00

CPC classification number: H01L21/7684 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/311 ,  H01L21/76898 ,  H01L23/5226 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05583 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provided is a method of manufacturing a semiconductor device, the method including forming a via structure through a portion of a substrate; partially removing the substrate to expose a portion of the via structure; forming a protecting layer on the substrate to cover the portion of the via structure exposed by partially removing the substrate, the protecting layer including a photosensitive organic insulating material; curing the protecting layer to form a cured protecting layer; planarizing the cured protecting layer until a part of the via structure is exposed; and forming a pad structure to contact the part of the via structure exposed by planarizing the cured protecting layer.

Abstract translation: 提供一种制造半导体器件的方法，该方法包括通过衬底的一部分形成通孔结构; 部分地去除所述衬底以暴露所述通孔结构的一部分; 在所述衬底上形成保护层以覆盖通过部分去除所述衬底而暴露的所述通路结构的所述部分，所述保护层包括光敏有机绝缘材料; 固化保护层以形成固化的保护层; 使固化的保护层平坦化，直到通孔结构的一部分露出; 以及形成衬垫结构，以使通过平坦化固化的保护层暴露的通孔结构的部分接触。

公开(公告)号：US20140316164A1

公开(公告)日：2014-10-23

申请号：US14319554

申请日：2014-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn-Joung CHO ,  Senji WADA ,  Jung-Sik CHOI ,  Jin-Seo LEE ,  Atsushi SAKURAI ,  Kyoo-Chul CHO ,  Atsuya YOSHINAKA ,  Haruyoshi SATO ,  Junji UEYAMA ,  Tomoharu YOSHINO ,  Masako SHIMIZU

IPC: C07F3/00

CPC classification number: C07F3/003 ,  C07C249/02 ,  C07C251/08 ,  C23C16/18

Abstract: The β-ketoimine ligand is represented by the following formula 1: wherein R1 and R2 are each independently a C1-C5 alkyl group. A metal complex compound includes the β-ketoimine ligand. A method of forming the β-ketoimine ligand and a method of forming a thin film using the metal complex compound including β-ketoimine ligand are provided.

公开(公告)号：US20140309456A1

公开(公告)日：2014-10-16

申请号：US14317102

申请日：2014-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youn-Joung CHO ,  Senji WADA ,  Jung-Sik CHOI ,  Jin-Seo LEE ,  Atsushi SAKURAI ,  Kyoo-Chul CHO ,  Atsuya YOSHINAKA ,  Haruyoshi SATO ,  Junji UEYAMA ,  Tomoharu YOSHINO ,  Masako SHIMIZU

IPC: C07C251/08

CPC classification number: C07F3/003 ,  C07C249/02 ,  C07C251/08 ,  C23C16/18

Abstract: The β-ketoimine ligand is represented by the following formula 1: wherein R1 and R2 are each independently a C1-C5 alkyl group. A metal complex compound includes the β-ketoimine ligand. A method of forming the β-ketoimine ligand and a method of forming a thin film using the metal complex compound including β-ketoimine ligand are provided.

Abstract translation: 酮亚胺配体由下式1表示：其中R 1和R 2各自独立地为C 1 -C 5烷基。 金属络合物包括β-酮亚胺配体。 提供了形成β-酮亚胺配体的方法以及使用包括β-酮亚胺配体的金属络合物形成薄膜的方法。

公开(公告)号：US20140199820A1

公开(公告)日：2014-07-17

申请号：US14143255

申请日：2013-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Man PARK ,  Hyo-Jin YUN ,  Jin-Seo LEE ,  Youn-Joung CHO ,  Jun-Hyun CHO ,  Jung-Sik CHOI

IPC: H01L21/308 ,  H01L45/00

CPC classification number: H01L21/3088 ,  H01L21/0274 ,  H01L27/2409 ,  H01L27/2463 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/1246 ,  H01L45/144 ,  H01L45/1683

Abstract: A method of forming a pattern includes forming an underlayer on an etching target layer by a chemical vapor deposition (CVD) process, the underlayer including a silicon compound combined with a photoacid generator (PAG), forming a photoresist layer on the underlayer, irradiating extreme ultraviolet (EUV) light on the photoresist layer to form a photoresist pattern, and etching the etching target layer using the photoresist pattern as an etching mask.

Abstract translation: 形成图案的方法包括通过化学气相沉积（CVD）工艺在蚀刻靶层上形成底层，底层包括与光致酸产生剂（PAG）组合的硅化合物，在底层上形成光致抗蚀剂层，照射极端 在光致抗蚀剂层上形成紫外线（EUV）光以形成光致抗蚀剂图案，并使用光刻胶图案蚀刻蚀刻目标层作为蚀刻掩模。

公开(公告)号：US20140197038A1

公开(公告)日：2014-07-17

申请号：US14155776

申请日：2014-01-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myung-Beom PARK ,  Yun-Deok KANG ,  Ki-Hyeon KIM ,  Youn-Joung CHO ,  Jung-Sik CHOI

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C25D5/04 ,  C25D5/08 ,  C25D17/001 ,  C25D17/06 ,  C25D21/14

Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.

Abstract translation: 电镀液包括水溶性铜盐，硫化物离子和氯离子的水性电解质溶液，包含具有硫（S）的有机材料，促进铜（Cu）还原的促进剂的促进剂，包含聚醚化合物的抑制剂，抑制剂 选择性地抑制铜还原，以及包含在电解质水溶液中溶解成正离子的具有氮的水溶性聚合物的整平剂。

公开(公告)号：US20140242263A1

公开(公告)日：2014-08-28

申请号：US14176173

申请日：2014-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Chul YOUN ,  Atsushi SAKURAI ,  Masako HATASE ,  Youn-Joung CHO ,  Ji-Na KANG ,  Naoki YAMADA ,  Jung-Sik CHOI

IPC: H01G13/00

CPC classification number: H01G4/33 ,  H01G4/085 ,  H01G4/1272 ,  H01L27/10852 ,  H01L28/40

Abstract: An aluminum compound is represented by following Formula 1. In Formula 1, X is a functional group represented by following Formula 2 or Formula 3.

Abstract translation: 铝化合物由下式1表示。在式1中，X是由下式2或式3表示的官能团。

公开(公告)号：US20140240179A1

公开(公告)日：2014-08-28

申请号：US14155924

申请日：2014-01-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Man KIM ,  Hong-Ki KIM ,  Byung-Kyu KIM ,  Sang-Tae LEE ,  Jung-Sik CHOI

IPC: H01Q1/24 ,  H01P11/00

CPC classification number: H01Q1/243 ,  H01P11/001 ,  H01Q1/02 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q7/00 ,  Y10T29/49018

Abstract: A portable terminal employing a near field communication antenna with a heat radiation function is provided. The portable terminal includes a cover provided for the portable terminal, and an antenna device mounted on an inner surface of the cover. The antenna device includes a near field communication antenna coupled to a location on the inner surface of the cover, a shield sheet coupled to an upper surface of the antenna, a heat radiation sheet coupled to an upper surface of the shield sheet so as to discharge heat transmitted from the portable terminal, and a protection cover coupled to an upper surface of the heat radiation sheet.

Abstract translation: 提供了采用具有散热功能的近场通信天线的便携式终端。 便携式终端包括为便携式终端提供的盖，以及安装在盖的内表面上的天线装置。 天线装置包括耦合到盖的内表面上的位置的近场通信天线，耦合到天线的上表面的屏蔽片，耦合到屏蔽片的上表面的放热片，以便放电 从便携式终端传输的热量以及耦合到散热片的上表面的保护罩。