公开(公告)号：US11080186B2

公开(公告)日：2021-08-03

申请号：US16547410

申请日：2019-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Kyu Bang ,  Young-Min Kim ,  Kwan-Bin Yim

IPC: G06F12/0804 ,  G06F3/06

Abstract: Provided is a storage device including a power management integrated circuit chip; multiple non-volatile memories configured to receive power from the power management integrated circuit chip; and a controller configured to control the non-volatile memories, wherein the controller checks a state of the power during a read operation and a write operation on the non-volatile memories and, when a power failure is detected in at least one of the non-volatile memories, implements a power failure detection mode regarding the read operation and the write operation on all of the non-volatile memories.

公开(公告)号：US11586538B2

公开(公告)日：2023-02-21

申请号：US17359873

申请日：2021-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Kyu Bang ,  Young-Min Kim ,  Kwan-Bin Yim

IPC: G06F12/0804 ,  G06F3/06

Abstract: Provided is a storage device including a power management integrated circuit chip; multiple non-volatile memories configured to receive power from the power management integrated circuit chip; and a controller configured to control the non-volatile memories, wherein the controller checks a state of the power during a read operation and a write operation on the non-volatile memories and, when a power failure is detected in at least one of the non-volatile memories, implements a power failure detection mode regarding the read operation and the write operation on all of the non-volatile memories.

公开(公告)号：US09888565B2

公开(公告)日：2018-02-06

申请号：US15176778

申请日：2016-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Kyu Bang ,  Yusuf Cinar ,  Hwi-Jong Yoo

IPC: G01B7/16 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/0269 ,  H05K1/0296 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09727 ,  H05K2201/10159

Abstract: A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.

公开(公告)号：US20170094781A1

公开(公告)日：2017-03-30

申请号：US15176778

申请日：2016-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Kyu Bang ,  Yusuf Cinar ,  Hwi-Jong Yoo

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/0269 ,  H05K1/0296 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09727 ,  H05K2201/10159

Abstract: A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.