公开(公告)号：US10763243B2

公开(公告)日：2020-09-01

申请号：US16135122

申请日：2018-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Hyung Kim ,  Sung-Hyup Kim ,  Kyeong-Bin Lim ,  Seok-Ho Kim ,  Tae-Yeong Kim

IPC: H01L25/065 ,  H01L21/67 ,  H01L25/00 ,  H01L21/66 ,  H01L21/687 ,  H01L21/68

Abstract: A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.