公开(公告)号：US20210225868A1

公开(公告)日：2021-07-22

申请号：US17009075

申请日：2020-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungeun PARK ,  Jae-Joo SHIM ,  Dongsung WOO ,  Jongkwang LIM ,  Jaehoon JANG

IPC: H01L27/11582 ,  H01L27/11556 ,  H01L27/11573 ,  H01L27/11565 ,  H01L27/11519 ,  H01L27/11539 ,  G11C7/18

Abstract: Disclosed is a three-dimensional semiconductor memory device comprising a substrate including a cell region and a connection region, a plurality of inter-electrode dielectric layers and a plurality of electrode layers alternately stacked on the substrate, wherein ends of the plurality of electrode layers form a stepwise shape on the connection region, a planarized dielectric layer on the connection region and covering the ends of the plurality of electrode layers, and a first abnormal dummy vertical pattern on the connection region and penetrating the planarized dielectric layer in a first direction perpendicular to a top surface of the substrate. At least one of the plurality of electrode layers is positioned between the first abnormal dummy vertical pattern and the substrate and is insulated from the first abnormal dummy vertical pattern.

公开(公告)号：US20240381641A1

公开(公告)日：2024-11-14

申请号：US18435342

申请日：2024-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungeun PARK ,  Solmi KWAK ,  Jinhyuk KIM ,  Hyeongjin KIM ,  Jeongyong SUNG ,  Minsoo SHIN ,  Seungjun SHIN ,  Joongshik SHIN ,  Sunghee CHUNG ,  Jeehoon HAN

IPC: H10B43/27 ,  H10B41/27 ,  H10B41/40 ,  H10B43/40

Abstract: A vertical memory device may include a common source plate on a substrate including a first region and a second region; gate pattern structures on the common source plate and extending from the first region to the second region, wherein the gate pattern structures include gate patterns and first insulation layers, and wherein the adjacent gate pattern structures are spaced apart from each other; first separation patterns filling first openings between the adjacent gate pattern structures on the first region; second separation patterns filling second openings between the adjacent gate pattern structures on the second region, wherein at least one of the second separation patterns is connected to at least one of the first separation patterns, and wherein the second separation pattern has a shape different from a shape of the first separation pattern; and channel structures passing through the gate pattern structures on the first region.