公开(公告)号：US20190214283A1

公开(公告)日：2019-07-11

申请号：US15867658

申请日：2018-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Matthew JESTER ,  Robert BELL ,  Robert STEBBINS ,  Soren SPRISSLER

IPC: H01L21/67 ,  B66F11/00

CPC classification number: H01L21/67196 ,  B66F11/00

Abstract: A process system of performing a fabrication process on a wafer includes a wafer storage cassette, process chambers, a transfer chamber having a body and a lid that detachably covers the body, a frame configured to support the transfer chamber, and a lifting tool connected to the lid and extended from the lid over a portion of the frame. The body of the transfer chamber is connected to the wafer storage cassette and the plurality of process chambers so that the wafer is transferred from the wafer storage cassette through the body of the transfer chamber to one of the process chambers.