公开(公告)号：US11749702B2

公开(公告)日：2023-09-05

申请号：US17222514

申请日：2021-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Hoon Kim ,  Min-Geun Kwon

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14636 ,  H01L24/05 ,  H01L27/14623 ,  H01L27/14685 ,  H01L24/06 ,  H01L27/14621 ,  H01L27/14634 ,  H01L2224/05025 ,  H01L2224/05082 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05624 ,  H01L2224/06181

Abstract: An image sensor includes a substrate including a pixel region and a pad region and having a first surface and a second surface opposite to the first surface, the pad region of the substrate being provided with a first recess which is recessed to a first depth from the second surface toward the first surface and the pixel region of the substrate being provided with a plurality of unit pixels, an interlayer insulating layer disposed on the first surface, an interconnection line disposed in the interlayer insulating layer, a conductive pad disposed in the first recess of the pad region, and a plurality of penetration structures disposed in the pad region of the substrate and extending from a bottom surface of the first recess to the first surface of the substrate, and electrically connecting the conductive pad to the interconnection line.

公开(公告)号：US20220020804A1

公开(公告)日：2022-01-20

申请号：US17222514

申请日：2021-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Hoon Kim ,  Min-Geun Kwon

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor includes a substrate including a pixel region and a pad region and having a first surface and a second surface opposite to the first surface, the pad region of the substrate being provided with a first recess which is recessed to a first depth from the second surface toward the first surface and the pixel region of the substrate being provided with a plurality of unit pixels, an interlayer insulating layer disposed on the first surface, an interconnection line disposed in the interlayer insulating layer, a conductive pad disposed in the first recess of the pad region, and a plurality of penetration structures disposed in the pad region of the substrate and extending from a bottom surface of the first recess to the first surface of the substrate, and electrically connecting the conductive pad to the interconnection line.