公开(公告)号：US20250105178A1

公开(公告)日：2025-03-27

申请号：US18634322

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： MinKi AHN ,  Kwangho LEE ,  Heeseok LEE ,  Jaegwon JANG ,  Heejung CHOI

IPC: H01L23/00

Abstract: A semiconductor chip according to an embodiment includes a semiconductor substrate, an interconnection pad on a first surface of the semiconductor substrate, an insulation layer being on the first surface of the semiconductor substrate and defining an opening that exposes at least a partial portion of the interconnection pad, a capping pad being on the insulation layer and being connected to the interconnection pad through the opening, and an insulation structure at a periphery of the capping pad on the insulation layer.