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公开(公告)号:US20240105842A1
公开(公告)日:2024-03-28
申请号:US18456934
申请日:2023-08-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sunghwan JANG , Dohee KIM , Pyung MOON , Sunguk JANG , Mina SEOL
IPC: H01L29/78 , H01L21/02 , H01L21/308 , H01L29/40
CPC classification number: H01L29/7827 , H01L21/02532 , H01L21/308 , H01L29/401
Abstract: In a method of manufacturing a semiconductor device, a first selective epitaxial growth (SEG) process is performed on a substrate to form a first channel. A first etching process is performed to form a first recess through the first channel and an upper portion of the substrate. A sidewall of the first channel exposed by the first recess is slanted with respect to an upper surface of the substrate. A second SEG process is performed to form a second channel on a surface of the substrate and the sidewall of the first channel exposed by the first recess. A gate structure is formed to fill the first recess. An impurity region is formed at an upper portion of the substrate adjacent to the gate structure.