公开(公告)号：US20220361339A1

公开(公告)日：2022-11-10

申请号：US17591734

申请日：2022-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghwa KIM ,  Junso PAK ,  Heeseok LEE ,  Moonseob JEONG ,  Jisoo HWANG

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H05K1/02

Abstract: A semiconductor package including a circuit board including a first wiring region, a die mounting region surrounding the first wiring region, and a second wiring region surrounding the die mounting region; a plurality of wiring balls on the first wiring region and the second wiring region and spaced apart from one another, the plurality of wiring balls including a plurality of first wiring balls on the first wiring region and a plurality of second wiring balls on the second wiring region; a die on the die mounting region, the die including a plurality of unit chips spaced apart from one another, and a die-through region corresponding to the first wiring region and exposing the first wiring balls; and a plurality of die balls on the die and the die mounting region, the plurality of die balls being spaced apart from one another and electrically coupled to the circuit board.

公开(公告)号：US20220068870A1

公开(公告)日：2022-03-03

申请号：US17230192

申请日：2021-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun So PAK ,  Junghwa KIM ,  Heeseok LEE ,  Moonseob JEONG

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor package may include a semiconductor chip including a chip pad, a redistribution structure including a redistribution insulation layer on the semiconductor chip and first redistribution patterns on a surface of the redistribution insulation layer, a passivation layer covering the first redistribution patterns, an UBM pattern on the passivation layer and extending into an opening of the passivation layer, a second redistribution pattern on the UBM pattern, conductive pillars on the second redistribution pattern, and a package connection terminal on the conductive pillars. The opening in the passivation layer may vertically overlap a portion of each of the first redistribution patterns. The second redistribution pattern may connect some of the first redistribution patterns to each other. Some of the conductive pillars may be connected to one another through the second redistribution pattern. The first redistribution patterns may be connected to the chip pad.

公开(公告)号：US20230061795A1

公开(公告)日：2023-03-02

申请号：US17983487

申请日：2022-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsang CHO ,  Heeseok LEE ,  Yunhyeok IM ,  Moonseob JEONG

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.

公开(公告)号：US20200328187A1

公开(公告)日：2020-10-15

申请号：US16592897

申请日：2019-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsang CHO ,  Heeseok LEE ,  Yunhyeok IM ,  Moonseob JEONG

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.