公开(公告)号：US20220068870A1

公开(公告)日：2022-03-03

申请号：US17230192

申请日：2021-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun So PAK ,  Junghwa KIM ,  Heeseok LEE ,  Moonseob JEONG

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor package may include a semiconductor chip including a chip pad, a redistribution structure including a redistribution insulation layer on the semiconductor chip and first redistribution patterns on a surface of the redistribution insulation layer, a passivation layer covering the first redistribution patterns, an UBM pattern on the passivation layer and extending into an opening of the passivation layer, a second redistribution pattern on the UBM pattern, conductive pillars on the second redistribution pattern, and a package connection terminal on the conductive pillars. The opening in the passivation layer may vertically overlap a portion of each of the first redistribution patterns. The second redistribution pattern may connect some of the first redistribution patterns to each other. Some of the conductive pillars may be connected to one another through the second redistribution pattern. The first redistribution patterns may be connected to the chip pad.

公开(公告)号：US20200381347A1

公开(公告)日：2020-12-03

申请号：US16692333

申请日：2019-11-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo PU ,  Jun So PAK ,  Sung Wook MOON

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package may comprise: a first passivation layer forming an electrical connection with one or more first bumps; a substrate layer including a second passivation layer and a silicon layer; a back-end-of-line (BEOL) layer formed on the substrate layer; and a third passivation layer formed on the BEOL layer forming an electrical connection with one or more second bumps, wherein the substrate layer includes a first signal TSV (Through Silicon Via) which transmits a first signal between the BEOL layer and a first lower pad, a second signal TSV which transmits a second signal between the BEOL layer and a second lower pad, and a ground TSV which is disposed between the first signal TSV and the second signal TSV and formed so that one end thereof is connected to the BEOL layer and the other end thereof floats.