公开(公告)号：US20240120224A1

公开(公告)日：2024-04-11

申请号：US18465533

申请日：2023-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Hyuk CHOI ,  Beom Soo HWANG ,  Kong Woo LEE ,  Myung Ki SONG ,  Ja-Yul KIM ,  Kyu Sang LEE ,  Hyun Joo JEON ,  Nam Young CHO

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67386 ,  H01L21/67259 ,  H01L21/67294 ,  H01L21/67742 ,  H01L21/68 ,  H01L21/6833

Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.