公开(公告)号：US10295669B2

公开(公告)日：2019-05-21

申请号：US15945623

申请日：2018-04-04

Applicant: Samsung Electronics Co., LTD.

Inventor： Peter Deane

IPC: H04N5/225 ,  G01S17/89 ,  G01S17/10 ,  G01S17/42 ,  G01S17/48 ,  G01S7/481 ,  G01S7/486

Abstract: An apparatus and method for determining a distance to an object using a binary, event-based image sensor. In one aspect, the image sensor includes memory circuitry and address decode circuitry. In one aspect, activation of a photodiode of the image sensor array by receipt of one or more photons is able to be used directly as an input to logic circuitry. In one embodiment, the image sensor includes photodiodes operating in an avalanche photodiode mode or Geiger mode. In one embodiment, the imaging sensor includes photodiodes operating as thresholded integrating pixels. The imaging sensor can be fabricated from one or more substrates having at least a first and a second voltage portion.

公开(公告)号：US09661308B1

公开(公告)日：2017-05-23

申请号：US14989716

申请日：2016-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yibing Michelle Wang ,  Ilia Ovsiannikov ,  Peter Deane

IPC: H04N13/02 ,  H04N5/378 ,  H04N5/376 ,  G06T7/00 ,  G06T7/60 ,  H04N13/00 ,  G01B11/25

CPC classification number: H04N13/261 ,  G01B11/25 ,  G06T7/521 ,  G06T7/62 ,  G06T2207/10016 ,  G06T2207/10152 ,  H04N5/3765 ,  H04N5/378 ,  H04N13/128 ,  H04N13/257

Abstract: Using the same image sensor to capture a two-dimensional (2D) image and three-dimensional (3D) depth measurements for a 3D object. A laser point-scans the surface of the object with light spots, which are detected by a pixel array in the image sensor to generate the 3D depth profile of the object using triangulation. Each row of pixels in the pixel array forms an epipolar line of the corresponding laser scan line. Timestamping provides a correspondence between the pixel location of a captured light spot and the respective scan angle of the laser to remove any ambiguity in triangulation. An Analog-to-Digital Converter (ADC) in the image sensor operates as a Time-to-Digital Converter (TDC) to generate timestamps. When the epipolar line is misaligned or curved, multiple TDC arrays acquire timestamps of multiple pixels (in multiple rows) substantially simultaneously. Multiple timestamp values are reconciled to obtain a single timestamp value for a light spot.

公开(公告)号：US11153551B2

公开(公告)日：2021-10-19

申请号：US16773505

申请日：2020-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilia Ovsiannikov ,  Yibing Michelle Wang ,  Peter Deane

IPC: H04N13/257 ,  H04N13/254 ,  G01B11/25 ,  H04N13/296 ,  H04N13/271 ,  G03B35/02

Abstract: An apparatus and a method are provided. The apparatus includes a light source configured to project light in a changing pattern that reduces the light's noticeability; collection optics through which light passes and forms an epipolar plane with the light source; and an image sensor configured to receive light passed through the collection optics to acquire image information and depth information simultaneously. The method includes projecting light by a light source in a changing pattern that reduces the light's noticeability; passing light through collection optics and forming an epipolar plane between the collection optics and the light source; and receiving in an image sensor light passed through the collection optics to acquire image information and depth information simultaneously.

公开(公告)号：US10605922B2

公开(公告)日：2020-03-31

申请号：US16418706

申请日：2019-05-21

Applicant: Samsung Electronics Co., LTD

Inventor： Peter Deane

IPC: H04N5/775 ,  G01S17/89 ,  G01S17/10 ,  G01S17/42 ,  G01S17/48 ,  G01S7/481 ,  G01S7/4863 ,  H04N5/225

Abstract: An apparatus and method for determining a distance to an object using a binary, event-based image sensor. In one aspect, the image sensor includes memory circuitry and address decode circuitry. In one aspect, activation of a photodiode of the image sensor array by receipt of one or more photons is able to be used directly as an input to logic circuitry. In one embodiment, the image sensor includes photodiodes operating in an avalanche photodiode mode or Geiger mode. In one embodiment, the imaging sensor includes photodiodes operating as thresholded integrating pixels. The imaging sensor can be fabricated from one or more substrates having at least a first and a second voltage portion.

公开(公告)号：US10547830B2

公开(公告)日：2020-01-28

申请号：US14989554

申请日：2016-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilia Ovsiannikov ,  Yibing Michelle Wang ,  Peter Deane

IPC: H04N13/257 ,  G03B35/02 ,  H04N13/254 ,  G01B11/25 ,  H04N13/296 ,  G03B35/08 ,  G03B35/10 ,  H04N13/207

Abstract: An apparatus and a method are provided. The apparatus includes a light source configured to project light in a changing pattern that reduces the light's noticeability; collection optics through which light passes and forms an epipolar plane with the light source; and an image sensor configured to receive light passed through the collection optics to acquire image information and depth information simultaneously. The method includes projecting light by a light source in a changing pattern that reduces the light's noticeability; passing light through collection optics and forming an epipolar plane between the collection optics and the light source; and receiving in an image sensor light passed through the collection optics to acquire image information and depth information simultaneously.

公开(公告)号：US09952323B2

公开(公告)日：2018-04-24

申请号：US14680906

申请日：2015-04-07

Applicant: Samsung Electronics Co., LTD.

Inventor： Peter Deane

IPC: G01S17/89 ,  G01S17/10 ,  G01S17/42 ,  G01S17/48 ,  G01S7/481 ,  G01S7/486 ,  H04N5/225

CPC classification number: G01S17/89 ,  G01S7/4816 ,  G01S7/4817 ,  G01S7/4863 ,  G01S17/10 ,  G01S17/42 ,  G01S17/48 ,  H04N5/2256

Abstract: An apparatus and method for determining a distance to an object using a binary, event-based image sensor. In one aspect, the image sensor includes memory circuitry and address decode circuitry. In one aspect, activation of a photodiode of the image sensor array by receipt of one or more photons is able to be used directly as an input to logic circuitry. In one embodiment, the image sensor includes photodiodes operating in an avalanche photodiode mode or Geiger mode. In one embodiment, the imaging sensor includes photodiodes operating as thresholded integrating pixels. The imaging sensor can be fabricated from one or more substrates having at least a first and a second voltage portion.