公开(公告)号：US20220013370A1

公开(公告)日：2022-01-13

申请号：US17197274

申请日：2021-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEON HO LEE ,  YEONSEOK KIM ,  Eunyeong KIM

IPC: H01L21/48 ,  H01L25/00 ,  H01L21/683

Abstract: Disclosed is a method of fabricating a semiconductor package. The method may include providing a preliminary interposer substrate including connection terminals on a carrier substrate such that the connection terminals are oriented outward, preparing a release film including a base layer, an intermediate layer, and an adhesive layer, attaching the connection terminals to a first surface of the release film, detaching the carrier substrate from the preliminary interposer substrate, cutting the preliminary interposer substrate to form a plurality of interposer substrates separated from each other, irradiating a first light of a first wavelength onto the release film to form an air gap between the connection terminals and the release film, and detaching the interposer substrates from the release film. The intermediate substrate may include a light absorber absorbing the first light.

公开(公告)号：US20220020627A1

公开(公告)日：2022-01-20

申请号：US17191163

申请日：2021-03-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： HWAIL JIN ,  SEON HO LEE ,  YEONGSEOK KIM

IPC: H01L21/683 ,  H01L21/78 ,  C09J7/24 ,  C09J7/40 ,  C09J7/38

Abstract: A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.

公开(公告)号：US20240312826A1

公开(公告)日：2024-09-19

申请号：US18676639

申请日：2024-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： HWAIL JIN ,  SEON HO LEE ,  YEONGSEOK KIM

IPC: H01L21/683 ,  C09J7/24 ,  C09J7/38 ,  C09J7/40 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/241 ,  C09J7/385 ,  C09J7/401 ,  C09J7/403 ,  H01L21/78 ,  C09J2423/006 ,  C09J2433/005 ,  C09J2483/005 ,  Y10T428/14 ,  Y10T428/1457 ,  Y10T428/1476

Abstract: A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.