公开(公告)号：US20220020627A1

公开(公告)日：2022-01-20

申请号：US17191163

申请日：2021-03-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： HWAIL JIN ,  SEON HO LEE ,  YEONGSEOK KIM

IPC: H01L21/683 ,  H01L21/78 ,  C09J7/24 ,  C09J7/40 ,  C09J7/38

Abstract: A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.

公开(公告)号：US20230212440A1

公开(公告)日：2023-07-06

申请号：US18088856

申请日：2022-12-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： CHEONIL PARK ,  MYOUNGCHUL EUM ,  HWAIL JIN

IPC: C09J133/08 ,  C09J7/38 ,  C09J7/29 ,  C09J7/25 ,  B32B7/12 ,  B32B27/28 ,  B32B27/32 ,  B32B27/36 ,  B32B27/08

CPC classification number: C09J133/08 ,  C09J7/385 ,  C09J7/29 ,  C09J7/255 ,  B32B7/12 ,  B32B27/285 ,  B32B27/281 ,  B32B27/32 ,  B32B27/36 ,  B32B27/08 ,  B32B2307/732 ,  B32B27/308

Abstract: An adhesive composition includes a resin, a crosslinking agent, and a light absorber. The light absorber includes at least one selected from the group consisting of a benzophenone-based compound, a cyanoacrylate-based compound having a ring structure, a benzotriazole-based compound, and a sterically hindered amine compound having a ring structure.

公开(公告)号：US20240312826A1

公开(公告)日：2024-09-19

申请号：US18676639

申请日：2024-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： HWAIL JIN ,  SEON HO LEE ,  YEONGSEOK KIM

IPC: H01L21/683 ,  C09J7/24 ,  C09J7/38 ,  C09J7/40 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/241 ,  C09J7/385 ,  C09J7/401 ,  C09J7/403 ,  H01L21/78 ,  C09J2423/006 ,  C09J2433/005 ,  C09J2483/005 ,  Y10T428/14 ,  Y10T428/1457 ,  Y10T428/1476

Abstract: A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.

公开(公告)号：US20230087718A1

公开(公告)日：2023-03-23

申请号：US17861490

申请日：2022-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheonil PARK ,  MYOUNGCHUL EUM ,  HWAIL JIN

IPC: B32B37/12 ,  H01L21/768 ,  H01L21/304 ,  H01L21/683 ,  B32B7/12 ,  B32B38/10 ,  B32B37/18 ,  B32B3/30

Abstract: A method of manufacturing a semiconductor device may include bonding a carrier substrate onto a device wafer using an adhesive member, wherein the adhesive member includes a base film, a device adhesive film disposed on a lower surface of the base film and contacting the device wafer, and a carrier adhesive film disposed on an upper surface of the base film and contacting the carrier substrate. The device adhesive film includes a gas blowing agent, and the carrier adhesive film may not include a gas blowing agent.

公开(公告)号：US20200058615A1

公开(公告)日：2020-02-20

申请号：US16533450

申请日：2019-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HWAIL JIN ,  YONGWON CHOI ,  MYUNG-SUNG KANG ,  YEONGSEOK KIM ,  WONKEUN KIM

IPC: H01L23/00 ,  H01L21/78

Abstract: A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.