公开(公告)号：US20160314996A1

公开(公告)日：2016-10-27

申请号：US15099926

申请日：2016-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： IL HWAN KIM ,  Sang Hyun BAE ,  HYUEKJAE LEE ,  Taeje CHO ,  Kwang-chul CHOI

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B24B7/228

Abstract: The inventive concepts relate to a substrate treating apparatus and a method for treating a substrate using the same. The apparatus includes a spin chuck configured to support a substrate, a grinding head disposed over the spin chuck and configured to grind the substrate supported by the spin chuck, and a nozzle member including a jet nozzle configured to jet high-pressure water to the substrate supported by the spin chuck. The jet nozzle overlaps with the substrate to jet the high-pressure water to an edge of the substrate.

Abstract translation: 本发明的概念涉及基板处理装置和使用其的基板的处理方法。 该装置包括配置成支撑基板的旋转卡盘，设置在旋转卡盘上方并构造成研磨由旋转卡盘支撑的基板的研磨头，以及包括喷射喷嘴的喷嘴构件，该喷嘴构造成将高压水喷射到基板 由旋转卡盘支撑。 喷射喷嘴与基板重叠以将高压水喷射到基板的边缘。