公开(公告)号：US20160266341A1

公开(公告)日：2016-09-15

申请号：US14988739

申请日：2016-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Cheon PARK ,  Cha-Jea JO ,  Tae-je CHO

IPC: G02B6/43 ,  G02B6/122 ,  G02B6/42 ,  G02B6/44

CPC classification number: G02B6/43 ,  G02B6/1226 ,  G02B6/428 ,  G02B6/4283 ,  G02B6/4295 ,  G02B6/4416 ,  Y02E10/52

Abstract: A photonic integrated circuit is provided. The photonic integrated circuit includes a substrate having a through hole interconnecting a first surface and a second surface; a transmission wire passing through the through hole and including an optical transmission structure and an electrical transmission structure; and an optical-to-electrical converter connected to the optical transmission structure of the transmission wire on the first surface.

Abstract translation: 提供了一种光子集成电路。 光子集成电路包括具有互连第一表面和第二表面的通孔的基板; 传输线穿过通孔并包括光传输结构和电传输结构; 以及连接到第一表面上的传输线的光传输结构的光电转换器。