ADDRESS-REMAPPED MEMORY CHIP, MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME
    1.
    发明申请
    ADDRESS-REMAPPED MEMORY CHIP, MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME 有权
    地址重新存储芯片,包括其的存储器模块和存储器系统

    公开(公告)号:US20160148656A1

    公开(公告)日:2016-05-26

    申请号:US14803119

    申请日:2015-07-20

    Abstract: A memory chip includes a chip input-output pad unit, a plurality of semiconductor dies. The chip input-output pad unit includes a plurality of input-output pins connected to an external device and the plurality of semiconductor dies are connected commonly to the chip input-output pad unit and having a full memory capacity respectively. Each semiconductor die includes a die input-output pad unit, a memory region and a conversion block. The die input-output pad unit includes a plurality of input-output terminals respectively connected to the input-output pins of the chip input-output pad unit. The memory region includes an activated region corresponding to a portion of the full memory capacity and a deactivated region corresponding to a remainder portion of the full memory capacity. The conversion block connects the activated region except the deactivated region to the die input-output pad unit.

    Abstract translation: 存储器芯片包括芯片输入 - 输出焊盘单元,多个半导体管芯。 芯片输入输出焊盘单元包括连接到外部设备的多个输入输出引脚,并且多个半导体管芯分别连接到芯片输入 - 输出焊盘单元并具有完全存储器容量。 每个半导体管芯包括管芯输入 - 输出焊盘单元,存储区域和转换块。 管芯输入 - 输出焊盘单元包括分别连接到芯片输入 - 输出焊盘单元的输入 - 输出引脚的多个输入 - 输出端子。 存储器区域包括对应于全部存储器容量的一部分的激活区域和对应于完整存储器容量的剩余部分的去激活区域。 转换块将去激活区域之外的激活区域连接到管芯输入 - 输出焊盘单元。

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