公开(公告)号：US20230171535A1

公开(公告)日：2023-06-01

申请号：US18101271

申请日：2023-01-25

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Kibum KIM ,  Jinsu KIM ,  Seokjoon PARK ,  Hakjoon KIM

IPC分类号： H04R1/28 ,  H05K9/00 ,  H04R3/00 ,  H04R1/02

CPC分类号： H04R1/2826 ,  H05K9/0024 ,  H04R3/00 ,  H04R1/025 ,  H04R1/028 ,  H04R2400/11 ,  H04R2499/11 ,  H04M1/0277

摘要： The electronic device may include: a housing; a printed circuit board (PCB) disposed in the housing, the PCB including a first board surface facing a first direction and a second board surface opposite to the first board surface, and having an opening penetrating through a surface thereof, a sound module disposed in the opening so that a front thereof faces the first direction, and electrically connected to the PCB to generate a sound, a shield can connected to the second board surface to cover the opening, in a state in which the second board surface is viewed, and a frame disposed to face the first board surface.

公开(公告)号：US20230119170A1

公开(公告)日：2023-04-20

申请号：US18084994

申请日：2022-12-20

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Youngsun LEE ,  Dohyeon KIM ,  Byeongkeol KIM ,  Jinsu KIM ,  Seokjoon PARK ,  Jungje BANG ,  Hoyeon SEO ,  Jongbum LEE ,  Jongmin JEON

IPC分类号： H05K1/14 ,  B32B7/12 ,  B32B3/26

摘要： An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder

公开(公告)号：US20210153325A1

公开(公告)日：2021-05-20

申请号：US17096242

申请日：2020-11-12

申请人： Samsung Electronics Co., Ltd.

发明人： Sengtai LEE ,  Hyunseung YOON ,  Seokjoon PARK ,  Yonghwan HYUN

IPC分类号： H05B47/11 ,  G01S17/08

摘要： An electronic device for preventing misrecognition by a proximity sensor is provided. The electronic device includes a display, a proximity sensor disposed under the display, at least one processor operatively connected with the display and the proximity sensor, and a memory operatively connected with the processor. The memory stores instructions that, when executed, cause the at least one processor to in response to the display being turned on, detect a light entering the proximity sensor by using the proximity sensor, calibrate a reference range, based on a characteristic of the entering light, and identify whether an external object is close to the electronic device, based on the calibrated reference range.