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公开(公告)号:US20230119170A1
公开(公告)日:2023-04-20
申请号:US18084994
申请日:2022-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngsun LEE , Dohyeon KIM , Byeongkeol KIM , Jinsu KIM , Seokjoon PARK , Jungje BANG , Hoyeon SEO , Jongbum LEE , Jongmin JEON
Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder
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公开(公告)号:US20230354511A1
公开(公告)日:2023-11-02
申请号:US18348622
申请日:2023-07-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngsun LEE , Kideok KIM , Byeongkeol KIM , Jongbum LEE , Jongmin JEON , Jeongbeom CHO
CPC classification number: H05K1/0281 , H05K1/147 , H05K3/28 , H05K2201/10378
Abstract: An electronic device is provided. The electronic device includes a housing, a main circuit board arranged inside the housing, and at least one flexible circuit board electrically connected to the main circuit board, wherein the flexible circuit board includes a flexible circuit part, and a joining part arranged on one end of the flexible circuit part and connected to the main circuit board. A first joining part includes a first layer oriented a first direction and having at least one first connection hole, a second layer oriented in a second direction opposite to the first direction and has at least one second connection hole, and a reinforcement member which is arranged between the first and the second layer and is connected to the flexible circuit part while being arranged such that at least a portion thereof overlaps with the one end part of the flexible circuit part.
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