ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET

    公开(公告)号:US20230119170A1

    公开(公告)日:2023-04-20

    申请号:US18084994

    申请日:2022-12-20

    Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder

    FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

    公开(公告)号:US20230354511A1

    公开(公告)日:2023-11-02

    申请号:US18348622

    申请日:2023-07-07

    CPC classification number: H05K1/0281 H05K1/147 H05K3/28 H05K2201/10378

    Abstract: An electronic device is provided. The electronic device includes a housing, a main circuit board arranged inside the housing, and at least one flexible circuit board electrically connected to the main circuit board, wherein the flexible circuit board includes a flexible circuit part, and a joining part arranged on one end of the flexible circuit part and connected to the main circuit board. A first joining part includes a first layer oriented a first direction and having at least one first connection hole, a second layer oriented in a second direction opposite to the first direction and has at least one second connection hole, and a reinforcement member which is arranged between the first and the second layer and is connected to the flexible circuit part while being arranged such that at least a portion thereof overlaps with the one end part of the flexible circuit part.

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