公开(公告)号：US20220365132A1

公开(公告)日：2022-11-17

申请号：US17549005

申请日：2021-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kijae SONG ,  Jongkook KIM ,  Dongho LEE ,  Seonmi LEE

IPC: G01R31/28 ,  G01R1/04

Abstract: A test board for testing a semiconductor apparatus includes a first board configured to support a plurality of first Devices Under Test (DUTs) such that the plurality of first DUTs are mounted on the first board, a plurality of first inter-board connectors arranged on the first board, and a plurality of second boards stacked on the first board through the plurality of first inter-board connectors, each second board of the plurality of second boards having a surface configured to support a separate second DUT of a plurality of second DUTs such that the plurality of second DUTs are mounted on separate, respective second boards of the plurality of second board.

公开(公告)号：US20250012854A1

公开(公告)日：2025-01-09

申请号：US18620170

申请日：2024-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihyun CHOI ,  Seonmi LEE ,  Yonggyun KIM ,  Seongseob SHIN ,  Dahm YU ,  Dongho LEE

IPC: G01R31/28

Abstract: A test device includes a test board, a connector attached to a lower surface of the test board, a heating device disposed on an upper surface of the test board, the heating device configured to emit heat in response to a signal input through the connector, a temperature sensor disposed on the upper surface of the test board, the temperature sensor configured to measure a temperature of the heating device, and a test socket disposed on the upper surface of the test board, the test socket configured to transmit and receive a signal to and from the heating device and the temperature sensor. Before a test process is performed or after the test process is completed, an internal temperature of a chamber may be verified, thereby improving reliability of the test process.