公开(公告)号：US20170337988A1

公开(公告)日：2017-11-23

申请号：US15456195

申请日：2017-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joosung Yun ,  Seongseob SHIN ,  Moon-Ho LEE ,  Woonsup CHOI

IPC: G11C29/56

CPC classification number: G11C29/56016 ,  G01R31/2851 ,  G11C29/48 ,  G11C29/56012 ,  G11C2029/5602 ,  H04B2001/305

Abstract: A test apparatus includes a device under test (DUT) configured to exchange data using a serial interface protocol and a test controller configured to receive a binary vector corresponding to a physical layer of the serial interface protocol from an external device and to buffer and transmit the received binary vector to the DUT.

公开(公告)号：US20240077535A1

公开(公告)日：2024-03-07

申请号：US18300870

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soonil KWON ,  Seongseob SHIN ,  Dongho LEE

IPC: G01R31/319 ,  G01R31/28

CPC classification number: G01R31/31924 ,  G01R31/2834 ,  G01R31/31905

Abstract: Disclosed is a test board which includes a substrate that includes a device under test (DUT) placement area where a first DUT and a second DUT are disposed, a first load switch connected in series with the first DUT and configured to be set to a switch on state or a switch off state based on a first enable signal, a second load switch connected in series with the second DUT and configured to be set to the switch on state or the switch off state depending on a second enable signal, and a test controller. The test controller may be configured to perform a test operation in a (1-1)-th mode by activating the first enable signal and deactivating the second enable signal and then perform the test operation in a (1-2)-th mode by deactivating the first enable signal and activating the second enable signal.

公开(公告)号：US20250012854A1

公开(公告)日：2025-01-09

申请号：US18620170

申请日：2024-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihyun CHOI ,  Seonmi LEE ,  Yonggyun KIM ,  Seongseob SHIN ,  Dahm YU ,  Dongho LEE

IPC: G01R31/28

Abstract: A test device includes a test board, a connector attached to a lower surface of the test board, a heating device disposed on an upper surface of the test board, the heating device configured to emit heat in response to a signal input through the connector, a temperature sensor disposed on the upper surface of the test board, the temperature sensor configured to measure a temperature of the heating device, and a test socket disposed on the upper surface of the test board, the test socket configured to transmit and receive a signal to and from the heating device and the temperature sensor. Before a test process is performed or after the test process is completed, an internal temperature of a chamber may be verified, thereby improving reliability of the test process.