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公开(公告)号：US11424535B2
公开(公告)日：2022-08-23
申请号：US16199069
申请日：2018-11-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung Gil Jeon
IPC: H01Q3/26 , H01Q3/36 , H01Q1/24 , H01Q9/16 , H01Q21/28 , H01Q21/29 , H01Q21/00 , H01Q21/06 , H01Q1/52 , H04B7/00
Abstract: An electronic device is provided. The electronic device includes a cover glass, a rear cover which faces away from the cover glass, and a plurality of communication devices that are interposed between the cover glass and the rear cover. Each of the plurality of communication devices comprises a printed circuit board (PCB), an antenna array positioned at the PCB, a dielectric substance positioned on one surface of the antenna array, a conductor positioned on an opposite surface of the antenna array, and a communication circuit electrically connected with the antenna array. The communication circuit is configured to feed the antenna array and transmit/receive a signal in a specified frequency band based on an electrical path formed through the antenna array.
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公开(公告)号：US20170214123A1
公开(公告)日：2017-07-27
申请号：US15411075
申请日：2017-01-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung Sik Park , Seung Gil Jeon , Jung Su Ha
Abstract: An electronic device is provided. The electronic device includes a housing, a communication circuit disposed on one side of the housing, a multi-layered printed circuit board (PCB) disposed on one side of the housing and electrically connected to the communication circuit and an antenna radiator disposed on one side of the housing or defining at least a portion of an outer surface of the housing, and is electrically connected to the communication circuit and the multi-layered printed circuit board, wherein the multi-layered printed circuit board comprises a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance, a second conductive pattern disposed in at least another one of the plurality of layers thereof to form an inductance and a conductive plate disposed between the at least one and the at least other one of the plurality of layers and is electrically isolated from the first conductive pattern and the second conductive pattern.
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Patent Agency Ranking
公开(公告)号：US10950949B2
公开(公告)日：2021-03-16
申请号：US16130495
申请日：2018-09-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung Gil Jeon , Hyung Wook Kim , Jeong Heum Lee , Jong Hwan Lee , Ho Young Im
Abstract: An electronic device is provided. The electronic device includes a housing that includes a first surface, a second surface facing the first surface, and a side surface surrounding a space between the first and second surfaces, a printed circuit board (PCB) that is arranged inside the housing and includes at least one antenna unit, and a communication circuit that is arranged inside the PCB or between the PCB and the housing.
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公开(公告)号：US09923264B2
公开(公告)日：2018-03-20
申请号：US15146337
申请日：2016-05-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yeon Woo Kim , Jung Sik Park , Seung Gil Jeon
Abstract: An antenna is provided. The antenna includes a carrier having a via hole penetrating an outer surface and an inner surface thereof, a first antenna radiator formed on the outer surface of the carrier and at least a part of a surface of the carrier that defines the via hole, a second antenna radiator formed on an inner surface of the carrier and electrically contacting the first antenna radiator through the via hole, and a coupling member configured to electrically connect the second antenna radiator with a circuit board provided in the electronic device.
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公开(公告)号：US11223102B2
公开(公告)日：2022-01-11
申请号：US16614710
申请日：2018-05-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung Gil Jeon
Abstract: An electronic device according to an embodiment of the disclosure may include housing including a rear cover and a cover glass facing away from the rear cover, an antenna array interposed between the rear cover and the cover glass and including at least one or more antenna units, a printed circuit board (PCB) interposed between the antenna array and the cover glass, and a communication circuit disposed on the PCB and feeding the antenna array. Other various embodiments as understood from the specification are also possible.
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公开(公告)号：US11075444B2
公开(公告)日：2021-07-27
申请号：US16199876
申请日：2018-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung Gil Jeon , Jeong Heum Lee , Jae Bong Chun
Abstract: An electronic device is provided. The electronic device includes a housing that includes a front surface, a rear surface facing away from the front surface, and a side surface surrounding a space between the front surface and the rear surface, wherein the front surface includes a dielectric substance having a first permittivity and the rear surface includes a dielectric substance having a second permittivity, an antenna array that is positioned adjacent to the side surface, radiates a millimeter wave signal, the antenna array including at least one antenna element, a communication circuit that is electrically connected with the antenna array and communicates by using the millimeter wave signal, and an electrical element that is positioned to be spaced from the antenna array by a specified distance such that a radiation pattern of the millimeter wave signal radiated from the antenna array has a directivity toward the side surface.
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公开(公告)号：US10693215B2
公开(公告)日：2020-06-23
申请号：US15411075
申请日：2017-01-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung Sik Park , Seung Gil Jeon , Jung Su Ha
Abstract: An electronic device is provided. The electronic device includes a housing, a communication circuit disposed on one side of the housing, a multi-layered printed circuit board (PCB) disposed on one side of the housing and electrically connected to the communication circuit and an antenna radiator disposed on one side of the housing or defining at least a portion of an outer surface of the housing, and is electrically connected to the communication circuit and the multi-layered printed circuit board, wherein the multi-layered printed circuit board comprises a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance, a second conductive pattern disposed in at least another one of the plurality of layers thereof to form an inductance and a conductive plate disposed between the at least one and the at least other one of the plurality of layers and is electrically isolated from the first conductive pattern and the second conductive pattern.
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