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公开(公告)号:US20210280469A1
公开(公告)日:2021-09-09
申请号:US17328348
申请日:2021-05-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang Hyun LEE , Jeong Yun LEE , Seung Ju PARK , Geum Jung SEONG , Young Mook OH , Seung Soo HONG
IPC: H01L21/8234 , H01L27/088 , H01L29/417 , H01L21/8238 , H01L29/08 , H01L29/78 , H01L29/423
Abstract: A semiconductor device capable of improving operation performance and reliability, may include a gate insulating support to isolate gate electrodes that are adjacent in a length direction. The semiconductor device includes a first gate structure on a substrate, the first gate structure extending lengthwise in a first direction to have two long sides and two short sides, relative to each other, and including a first gate spacer; a second gate structure on the substrate, the second gate structure extending lengthwise in the first direction to have two long sides and two short sides, relative to each other, and including a second gate spacer, wherein a first short side of the second gate structure faces a first short side of the first gate structure; and a gate insulating support disposed between the first short side of the first gate structure and the first short side of the second gate structure and extending lengthwise in a second direction different from the first direction, a length of the gate insulating support in the second direction being greater than a width of each of the first gate structure and the second gate structure in the second direction.
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公开(公告)号:US20190326180A1
公开(公告)日:2019-10-24
申请号:US16460127
申请日:2019-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang Hyun LEE , Jeong Yun LEE , Seung Ju PARK , Geum Jung SEONG , Young Mook OH , Seung Soo HONG
IPC: H01L21/8234 , H01L27/088 , H01L29/78 , H01L29/08 , H01L29/423
Abstract: A semiconductor device capable of improving operation performance and reliability, may include a gate insulating support to isolate gate electrodes that are adjacent in a length direction. The semiconductor device includes a first gate structure on a substrate, the first gate structure extending lengthwise in a first direction to have two long sides and two short sides, relative to each other, and including a first gate spacer; a second gate structure on the substrate, the second gate structure extending lengthwise in the first direction to have two long sides and two short sides, relative to each other, and including a second gate spacer, wherein a first short side of the second gate structure faces a first short side of the first gate structure; and a gate insulating support disposed between the first short side of the first gate structure and the first short side of the second gate structure and extending lengthwise in a second direction different from the first direction, a length of the gate insulating support in the second direction being greater than a width of each of the first gate structure and the second gate structure in the second direction.
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公开(公告)号:US20180138092A1
公开(公告)日:2018-05-17
申请号:US15718482
申请日:2017-09-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang Hyun LEE , Jeong Yun LEE , Seung Ju PARK , Geum Jung SEONG , Young Mook OH , Seung Soo HONG
IPC: H01L21/8234 , H01L29/66 , H01L27/088 , H01L29/423
CPC classification number: H01L21/823462 , H01L21/823431 , H01L21/823437 , H01L21/823468 , H01L21/823475 , H01L21/823481 , H01L27/088 , H01L27/0886 , H01L29/0847 , H01L29/42364 , H01L29/6656 , H01L29/785
Abstract: A semiconductor device capable of improving operation performance and reliability, may include a gate insulating support to isolate gate electrodes that are adjacent in a length direction. The semiconductor device includes a first gate structure on a substrate, the first gate structure extending lengthwise in a first direction to have two long sides and two short sides, relative to each other, and including a first gate spacer; a second gate structure on the substrate, the second gate structure extending lengthwise in the first direction to have two long sides and two short sides, relative to each other, and including a second gate spacer, wherein a first short side of the second gate structure faces a first short side of the first gate structure; and a gate insulating support disposed between the first short side of the first gate structure and the first short side of the second gate structure and extending lengthwise in a second direction different from the first direction, a length of the gate insulating support in the second direction being greater than a width of each of the first gate structure and the second gate structure in the second direction.
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公开(公告)号:US20230238283A1
公开(公告)日:2023-07-27
申请号:US18118505
申请日:2023-03-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang Hyun LEE , Jeong Yun LEE , Seung Ju PARK , Geum Jung SEONG , Young Mook OH , Seung Soo HONG
IPC: H01L21/8234 , H01L27/088 , H01L29/423 , H01L29/78 , H01L29/417 , H01L21/8238 , H01L29/08 , H01L29/66
CPC classification number: H01L21/823462 , H01L21/823437 , H01L21/823481 , H01L21/823821 , H01L27/088 , H01L29/785 , H01L29/0847 , H01L29/41791 , H01L29/42364 , H01L21/823431 , H01L21/823468 , H01L21/823475 , H01L27/0886 , H01L29/6656
Abstract: A semiconductor device capable of improving operation performance and reliability, may include a gate insulating support to isolate gate electrodes that are adjacent in a length direction. The semiconductor device includes a first gate structure on a substrate, the first gate structure extending lengthwise in a first direction to have two long sides and two short sides, relative to each other, and including a first gate spacer; a second gate structure on the substrate, the second gate structure extending lengthwise in the first direction to have two long sides and two short sides, relative to each other, and including a second gate spacer, wherein a first short side of the second gate structure faces a first short side of the first gate structure; and a gate insulating support disposed between the first short side of the first gate structure and the first short side of the second gate structure and extending lengthwise in a second direction different from the first direction, a length of the gate insulating support in the second direction being greater than a width of each of the first gate structure and the second gate structure in the second direction.
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