公开(公告)号：US20240363579A1

公开(公告)日：2024-10-31

申请号：US18588268

申请日：2024-02-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungyeop OH ,  Youngja KIM

IPC: H01L23/00 ,  B23K1/012 ,  B23K3/047 ,  B23K3/08 ,  B23K101/40 ,  H01L23/31

CPC classification number: H01L24/75 ,  B23K1/012 ,  B23K3/0471 ,  B23K3/087 ,  H01L24/16 ,  H01L24/81 ,  B23K2101/40 ,  H01L23/3121 ,  H01L2224/16227 ,  H01L2224/75272 ,  H01L2224/75651 ,  H01L2224/75652 ,  H01L2224/81815

Abstract: A solder reflow apparatus may include a vapor generating chamber configured to accommodate a heat transfer fluid, a heater configured to heat the heat transfer fluid, a vertical transfer portion, and at least one substrate stage. The vertical transfer portion may include a vertical conveyer supported by a driving pulley and a driven pulley so as to be rotatable in an endless track, the vertical conveyer having a conveying route of a descending path and an ascending path in the vapor generating chamber, and at least one substrate stage fixedly fastened to one side of the vertical conveyor by a fastening portion so as to be raised and lowered in the vapor generating chamber by rotation of the vertical conveyor. The at least one substrate stage may be configured to support a substrate on which an electronic component may be mounted via a solder.