公开(公告)号：US12068549B2

公开(公告)日：2024-08-20

申请号：US17975085

申请日：2022-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjeong Lee ,  Himchan Yun ,  Bomyoung Kim ,  Sewoong Kim ,  Soonho Hwang ,  Jin Kim ,  Jongoh Lim

IPC: H01Q9/04 ,  H01Q5/35 ,  H01Q21/06

CPC classification number: H01Q9/045 ,  H01Q5/35 ,  H01Q21/065

Abstract: An electronic device is provided. The electronic device includes a housing, an antenna structure, a first conductive material, and a second conductive material. The housing may be configured to provide a front surface and a rear surface of the electronic device. The antenna structure includes a printed circuit board positioned in the housing. The printed circuit board includes a first surface configured to face the front surface or the rear surface and a second surface configured to face a direction opposite to the first surface. The printed circuit board includes a first conductive layer, a second conductive layer, and a dielectric. The first conductive layer includes a first antenna element and a second antenna element which are configured so as not to overlap each other when viewed from above the first surface.

公开(公告)号：US11824260B2

公开(公告)日：2023-11-21

申请号：US16972111

申请日：2019-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sewoong Kim ,  Chaeup Yoo ,  Sumin Yun ,  Woosuk Kang ,  Inyoung Lee

IPC: H01Q1/38 ,  H01Q1/24 ,  H05K1/02 ,  H05K5/00 ,  H05K7/14

CPC classification number: H01Q1/38 ,  H01Q1/24 ,  H05K1/02 ,  H05K1/0243 ,  H05K5/00 ,  H05K5/0017 ,  H05K5/0086 ,  H05K7/14 ,  H05K7/1427 ,  H05K2201/10037

Abstract: According to an embodiment, an electronic device may include a display including a first conductive plate, a printed circuit board interposed between a rear surface of housing and the display and including a second conductive plate, a first conductive pattern and a second conductive pattern that are interposed between the display and the printed circuit board, a wireless communication circuit electrically connected to the first conductive pattern and transmitting or receiving an RF signal of a first frequency or an RF signal of a second frequency, and at least one processor electrically connected to the wireless communication circuit. Besides, various embodiments as understood from the specification are also possible.

公开(公告)号：US11605878B2

公开(公告)日：2023-03-14

申请号：US17270507

申请日：2019-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonghoon Kim ,  Sewoong Kim ,  Woosuk Kang ,  Museok Bang ,  Chaeup Yoo

IPC: H05K7/14 ,  H01Q1/24 ,  H05K5/00 ,  H04B1/00

Abstract: According to various embodiments of the present invention, an electronic device may comprise: a housing comprising a first surface, a second surface oriented in the direction opposite from the first surface, and a side surface surrounding a space between the first surface and the second surface; a conductive member for forming at least a portion of the side surface; a display seen through the first surface and including a first conductive layer; a printed circuit board disposed to be spaced apart from the display between the display and the second surface in the housing, and including a second conductive layer in which at least a portion thereof faces the first conductive layer; a third conductive layer spaced apart from the display and the printed circuit board, disposed between the first conductive layer and the second conductive layer, and facing the first conductive layer; a support structure comprising a non-conductive plate which is formed between the third conductive layer and the printed circuit board and in which at least a portion thereof is in contact with the third conductive layer; a conductive pattern extending between the third conductive layer and the non-conductive plate and electrically connected to the second conductive layer; and a wireless communication circuit electrically connected to the conductive member and configured to transmit and/or receive an RF signal. Other various embodiments may be possible.

公开(公告)号：US11271304B2

公开(公告)日：2022-03-08

申请号：US16965904

申请日：2019-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chaeup Yoo ,  Woosuk Kang ,  Youngjae Ko ,  Sewoong Kim ,  Sangbong Sung ,  Sanggon Shin ,  Inyoung Lee ,  Jinwoo Jung ,  Suk Hyun

IPC: H01Q1/27 ,  H01Q5/35 ,  H01Q1/38 ,  H01Q1/48 ,  H04M1/02 ,  H01Q1/24

Abstract: According to various embodiments, an electronic device includes a front plate, a rear plate facing away from the front plate, and a side member surrounding the space between the front plate and the rear plate. The side member comprises: a housing including a conductive annular member; at least one mounting member connected to the side member and detachably mounted to a portion of the human body such that the rear plate is configured to be oriented toward a portion of the human body; a substrate (PCB) disposed in parallel with the front plate in the space and including a ground plane; at least one wireless communication circuit disposed on the substrate; a first electrical path connected between the wireless communication circuit and a first point of the conductive annular member; and a second electrical path connected between the ground plane and a second point of the conductive annular member, wherein a first region of the conductive annular member defined between the first point and the second point has a first length, and a second region of the conductive annular member defined between the first point and the second point has a second length that is shorter than the first length, wherein the side member includes an extension part disposed in the space and extending along a first region of the annular member or a portion of the second region and may include a conductive pattern electrically connected to the wireless communication circuit. Various other embodiments may be possible. Various embodiments may be possible.

公开(公告)号：US10224608B2

公开(公告)日：2019-03-05

申请号：US15217516

申请日：2016-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung-Jae Lee ,  Kyung-Jong Lee ,  Sewoong Kim ,  Soo-Young Jang ,  Seunghwan Kim ,  Hosaeng Kim ,  Jinwoo Jung

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q7/00 ,  H01Q9/42

Abstract: An electronic device is provided. The electronic device includes a housing including a first face, a second face, and a side face that at least partially encloses a space between the first face and the second face, a conductive member configured to form at least a portion of the side face, a ground member, at least one communication circuit, and a conductive pattern positioned within the housing, the conductive pattern electrically connected to the communication circuit and the ground member, a first electric path positioned within the housing, and configured to electrically interconnect another end of the conductive member and the communication circuit, a second electric path configured to electrically interconnect the first electric path or the conductive member and the ground member, and a third electric path configured to electrically interconnect the first electric path or the conductive member and the ground member, and including a switching circuit.