ELECTRONIC UNIT
    4.
    发明申请

    公开(公告)号:US20170347491A1

    公开(公告)日:2017-11-30

    申请号:US15534825

    申请日:2015-09-04

    摘要: Air in a thermally insulated space, which has been expanded by heat resulting from heating treatment for curing a thermosetting potting material, is prevented from entering the potting material. A casing has a partition wall that partitions an opening into a heat-generating-electronic-component placement section, where a heat generating electronic component is placed, and an adjacent section that is adjacent to the heat-generating-electronic-component placement section, when a heat releasing member is fixed to the opening. The heat-generating-electronic-component placement section is filled with a thermosetting potting material for moisture prevention up to a height which allows at least the heat generating electronic component to be buried in the potting material. The adjacent section has in the casing a communicating portion that communicates with a position which is apart from the heat-generating-electronic-component placement section filled with the potting material.