公开(公告)号：US12148784B2

公开(公告)日：2024-11-19

申请号：US17393855

申请日：2021-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Shik Kim ,  Min-Sun Keel ,  Hoon Joo Na ,  Kang Ho Lee ,  Kil Ho Lee ,  Sang Kil Lee ,  Jung Hyuk Lee ,  Shin Hee Han

IPC: H01L21/768 ,  H01L27/146

Abstract: An image sensor including a variable resistance element is provided. The image sensor comprises first and second chips having first and second connecting structures; and a contact plug connecting the first and second chips. The first chip includes a photoelectric conversion element. The second chip includes a first variable resistance element. The contact plug extends from the first surface of the first semiconductor substrate to connect the first and second connecting structures.