公开(公告)号：US20230328909A1

公开(公告)日：2023-10-12

申请号：US18209191

申请日：2023-06-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sookyu LEE ,  Jaewoong LIM

IPC: H05K5/03 ,  B44C3/02

CPC classification number: H05K5/03 ,  B44C3/02

Abstract: This application relates to an electronic device cover having a layered structure and a method for manufacturing the same. An embodiment may include a substrate including magnesium, a first chemical conversion-treated layer formed on the substrate, a bending supplement layer formed on the first chemical conversion-treated layer, a color layer formed on the bending supplement layer, and an ultraviolet molding layer formed on the color layer. Various other embodiments are possible.

公开(公告)号：US20220004231A1

公开(公告)日：2022-01-06

申请号：US17475526

申请日：2021-09-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsoo KIM ,  Sookyu LEE ,  Jaewoong LIM

IPC: G06F1/16 ,  C25D11/30 ,  C25D13/20 ,  C23C24/08 ,  C23G5/032 ,  H05K5/02 ,  H05K5/04

Abstract: A method for manufacturing a cover member for electronic devices according to certain embodiments of the present disclosure may comprise: a step for forming a magnesium plate; a step for performing primary CNC processing on the magnesium plate using a predetermined cutting oil; a step for performing a primary pretreatment on the magnesium plate using chromate or micro arc oxidation (MAO); a step for performing a primary surface-treatment on the magnesium plate by bake-coating or electrodeposition coating; a step for performing secondary CNC processing on a first region of the magnesium plate using an alcohol-containing cutting oil; a washing and drying step; a step for performing a secondary pretreatment for preventing oxidation on the first region; and a step for performing a secondary surface-treatment on the first region by bake-coating or electrodeposition coating.

公开(公告)号：US20210291582A1

公开(公告)日：2021-09-23

申请号：US17258513

申请日：2019-08-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sookyu LEE ,  Jaewoong LIM

IPC: B44C1/18 ,  B05D7/00 ,  G06F1/16 ,  B29C45/14 ,  B29C45/00

Abstract: Introduced is a case for an electronic device, the case comprising: a base layer for configuring a basic frame; a first pattern layer formed on the base layer; a second pattern layer applied onto the first pattern layer; and a clear-painted layer which is applied to coat the first pattern layer or the second pattern layer. In addition, various other embodiments are possible.