公开(公告)号：US10204912B2

公开(公告)日：2019-02-12

申请号：US15826944

申请日：2017-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon-mok Ha ,  Jae-hee Kim ,  Chan Hwang ,  Jong-hyuk Kim

IPC: H01L27/108 ,  H01L21/311 ,  H01L21/027 ,  H01L49/02

Abstract: A method of forming a micro-pattern including forming a mold layer and a supporting material layer on a substrate, patterning the mold layer and the supporting material layer to form recess patterns, forming conductor patterns in the recess patterns, removing a portion of an upper portion of the supporting material layer for causing upper portions of the conductor patterns to protrude, forming a block copolymer layer on the supporting material layer, processing the block copolymer layer to phase-separate the block copolymer layer into a plurality of block parts, selectively removing some of the phase-separated plurality of block parts, and removing the supporting material layer to expose the mold layer at a position corresponding to each of the removed block parts may be provided.

公开(公告)号：US10600789B2

公开(公告)日：2020-03-24

申请号：US16233715

申请日：2018-12-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon-mok Ha ,  Jae-hee Kim ,  Chan Hwang ,  Jong-hyuk Kim

IPC: H01L27/108 ,  H01L21/311 ,  H01L21/027 ,  H01L49/02

Abstract: A method of forming a micro-pattern including forming a mold layer and a supporting material layer on a substrate, patterning the mold layer and the supporting material layer to form recess patterns, forming conductor patterns in the recess patterns, removing a portion of an upper portion of the supporting material layer for causing upper portions of the conductor patterns to protrude, forming a block copolymer layer on the supporting material layer, processing the block copolymer layer to phase-separate the block copolymer layer into a plurality of block parts, selectively removing some of the phase-separated plurality of block parts, and removing the supporting material layer to expose the mold layer at a position corresponding to each of the removed block parts may be provided.