公开(公告)号：US11490509B2

公开(公告)日：2022-11-01

申请号：US17358800

申请日：2021-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunki Yun ,  Kwangkyu Bang ,  Jihong Kim ,  Eunji Yu ,  Kyungjae Kim ,  Yusuf Cinar

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

公开(公告)号：US11792921B2

公开(公告)日：2023-10-17

申请号：US17898907

申请日：2022-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunki Yun ,  Kwangkyu Bang ,  Jihong Kim ,  Eunji Yu ,  Kyungjae Kim ,  Yusuf Cinar

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0268 ,  H05K1/112 ,  H05K1/141 ,  H05K1/184 ,  H05K2201/10159

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.