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公开(公告)号：US20250021426A1
公开(公告)日：2025-01-16
申请号：US18430328
申请日：2024-02-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hwajeong Kwon , Taeyong Kim , Kwangkyu Bang , Sangkuk Lee
Abstract: An electronic system includes a monitored device and a management device. The monitored device operates according to an operating system and generates a display image. The management device is connected to the monitored device through a communication network. The management device periodically receives, from the monitored device, screen image data corresponding to the display image, determines whether an error that causes the operating system of the monitored device to become inoperable occurs in the operating system of the monitored device based on a network connection state with the monitored device, determines a type of the error based on error determination factors and an analysis result of the screen image data, and transfers, to the monitored device, a request indicating follow-up actions to take to resolve the error, the follow-up actions corresponding to the type of the error.
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公开(公告)号：US11792921B2
公开(公告)日：2023-10-17
申请号：US17898907
申请日：2022-08-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunki Yun , Kwangkyu Bang , Jihong Kim , Eunji Yu , Kyungjae Kim , Yusuf Cinar
CPC classification number: H05K1/0268 , H05K1/112 , H05K1/141 , H05K1/184 , H05K2201/10159
Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
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公开(公告)号：US11593242B2
公开(公告)日：2023-02-28
申请号：US16863531
申请日：2020-04-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kwangkyu Bang
Abstract: A method of operating a storage device includes sensing a standby current flowing through the storage device, determining based on the sensed standby current and at least one reference value whether a product abnormality has occurred within the storage device, and when it is determined the product abnormality has occurred, performing a step-wise control operation in which two or more control processes associated with an operation of the storage device are sequentially executed.
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公开(公告)号：US20230098635A1
公开(公告)日：2023-03-30
申请号：US17738272
申请日：2022-05-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kiljoong YUN , Kwangkyu Bang , Yun Chang , Jaegyu Choi
Abstract: A test socket includes: a first body including a fixing portion configured to receive a sample having a plurality of test terminals; a second body facing the first body and coupled with the first body such that the second body rotates relative to the first body about a hinge pin; a test board provided on the second body and configured to test the sample, wherein the test board has a plurality of first openings provided therein; and a plurality of interface pins penetrating through the first openings, wherein each of the plurality of interface pins includes a contact pin and a spring, wherein the contact pin is provided in a first end portion of each of the plurality of interface pin and is configured to come into contact with a test terminal of the plurality of test terminals, and the spring elastically supports the contact pin.
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公开(公告)号：US10713105B2
公开(公告)日：2020-07-14
申请号：US15961918
申请日：2018-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kwangkyu Bang , Young-Seop Shim , Heeyoub Kang , Kyungduk Lee
Abstract: An operating method of a memory controller to control a nonvolatile memory device includes receiving information about operation failure from the nonvolatile memory device, receiving lock-out status information from the nonvolatile memory device, determining whether a lock-out signal is output based on the lock-out status information, and determining a failure block corresponding to the information about the operation failure as a normal block or a bad block depending on the determination result.
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Patent Agency Ranking
公开(公告)号：US10175667B2
公开(公告)日：2019-01-08
申请号：US15098427
申请日：2016-04-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwangkyu Bang , Heeyoub Kang , HyoJae Bang , Kitaek Lee
Abstract: A storage device may include a nonvolatile memory including a plurality of memory blocks and a memory controller configured to determine a comparison between an idle current value of the nonvolatile memory and a reference current value and to adjust, based on the comparison, a start temperature at which the storage device begins operating speed control of the storage device.
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7.发明授权公开(公告)号：US12130306B2
公开(公告)日：2024-10-29
申请号：US17884661
申请日：2022-08-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kwangkyu Bang , Kiljoong Yun , Yun Chang , Jaegyu Choi
CPC classification number: G01R1/0466 , G01R1/0483 , G01R31/2863 , G01R31/2884
Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.
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公开(公告)号：US12038473B2
公开(公告)日：2024-07-16
申请号：US17738272
申请日：2022-05-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kiljoong Yun , Kwangkyu Bang , Yun Chang , Jaegyu Choi
CPC classification number: G01R31/2884 , G01R1/0408 , G01R31/2844 , G01R31/2863
Abstract: A test socket includes: a first body including a fixing portion configured to receive a sample having a plurality of test terminals; a second body facing the first body and coupled with the first body such that the second body rotates relative to the first body about a hinge pin; a test board provided on the second body and configured to test the sample, wherein the test board has a plurality of first openings provided therein; and a plurality of interface pins penetrating through the first openings, wherein each of the plurality of interface pins includes a contact pin and a spring, wherein the contact pin is provided in a first end portion of each of the plurality of interface pin and is configured to come into contact with a test terminal of the plurality of test terminals, and the spring elastically supports the contact pin.
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公开(公告)号：US12019485B2
公开(公告)日：2024-06-25
申请号：US17661703
申请日：2022-05-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yun Chang , Sanggeun Yoo , Kwangkyu Bang , Kiljoong Yun , Songrye Choi , Jaegyu Choi
IPC: G06F1/18
CPC classification number: G06F1/187
Abstract: A storage device testing module includes a plate and a test board disposed on the plate and including a storage device receiver, the storage device receiver receiving a storage device to be tested. The storage device testing module further includes a sensor including a plurality of switches disposed on an inner surface of the storage device receiver, the plurality of switches being activated by movement of the storage device into the storage device receiver. The storage device testing module further includes a plurality of plungers disposed on the inner surface, contacting and supporting the storage device.
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公开(公告)号：US11490509B2
公开(公告)日：2022-11-01
申请号：US17358800
申请日：2021-06-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunki Yun , Kwangkyu Bang , Jihong Kim , Eunji Yu , Kyungjae Kim , Yusuf Cinar
Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
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