公开(公告)号：US20220392781A1

公开(公告)日：2022-12-08

申请号：US17745254

申请日：2022-05-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Joon KIM ,  Jin Seok LEE ,  Bong Ju LEE ,  Tae Jong YU ,  Tae Sun SHIN ,  Sung Il CHO

IPC: H01L21/67 ,  C23C16/455

Abstract: There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor wafer processing device comprising a chamber, and, a showerhead configured to supply a gas into the chamber, wherein the showerhead includes, a plate, a plurality of first spray hole groups in a first row from a center of the plate, and a second spray hole group in a second row outside the first row, wherein each of the first spray hole groups includes a plurality of first spray holes, and when L is an average value of distances from the center of the plate to each spray hole of each of the first spray hole groups, the number of first spray holes where a distance from the center of the plate is smaller than L is more than the number of first spray holes where the distance from the center of the plate is greater than L.