公开(公告)号：US20200075338A1

公开(公告)日：2020-03-05

申请号：US16393232

申请日：2019-04-24

Applicant: Samsung Electronics Co., Ltd. ,  EO Technics Co., LTD

Inventor： Nam Hoon LEE ,  Ill Hyun PARK ,  Tae Hee HAN ,  Jin Won MA ,  Byung Joo OH ,  Bong Ju LEE ,  Jae Hee LEE ,  Joo Yong LEE ,  Nam Ki CHO ,  Chang Seong HONG

IPC: H01L21/268 ,  B23K26/354 ,  B23K26/03 ,  H01L21/67 ,  H01L21/66 ,  G01N21/25

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

公开(公告)号：US20220076957A1

公开(公告)日：2022-03-10

申请号：US17479256

申请日：2021-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Hoon LEE ,  Ill Hyun PARK ,  Tae Hee HAN ,  Jin Won MA ,  Byung Joo OH ,  Bong Ju LEE ,  Jae Hee LEE ,  Joo Yong LEE ,  Nam Ki CHO ,  Chang Seong HONG

IPC: H01L21/268 ,  B23K26/354 ,  G01N21/25 ,  H01L21/67 ,  H01L21/66 ,  B23K26/03

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

公开(公告)号：US20220392781A1

公开(公告)日：2022-12-08

申请号：US17745254

申请日：2022-05-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Joon KIM ,  Jin Seok LEE ,  Bong Ju LEE ,  Tae Jong YU ,  Tae Sun SHIN ,  Sung Il CHO

IPC: H01L21/67 ,  C23C16/455

Abstract: There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor wafer processing device comprising a chamber, and, a showerhead configured to supply a gas into the chamber, wherein the showerhead includes, a plate, a plurality of first spray hole groups in a first row from a center of the plate, and a second spray hole group in a second row outside the first row, wherein each of the first spray hole groups includes a plurality of first spray holes, and when L is an average value of distances from the center of the plate to each spray hole of each of the first spray hole groups, the number of first spray holes where a distance from the center of the plate is smaller than L is more than the number of first spray holes where the distance from the center of the plate is greater than L.

公开(公告)号：US20190289729A1

公开(公告)日：2019-09-19

申请号：US16353545

申请日：2019-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Huu Lam Vuong NGUYEN ,  Bong Ju LEE ,  Kwang Sung HWANG

IPC: H05K5/02 ,  H01L25/075 ,  H05K5/00

Abstract: Disclosed is a display apparatus including an LED module having a first fastening member, a front bracket having a second fastening member on which the LED module is mounted by an attractive force generated between the first and second fastening members, and at least one level adjusting member disposed on the LED module and configured to adjust a level difference between the LED module and another adjacent LED module.