公开(公告)号：US10665490B2

公开(公告)日：2020-05-26

申请号：US16240230

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Keon-Woo Kim ,  Sun-Ho Kim ,  Eung-Su Kim ,  Bo-Ra Yoon ,  Hyan-Jung Lee ,  Tae-Il Cho

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.

公开(公告)号：US20200013657A1

公开(公告)日：2020-01-09

申请号：US16240230

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Keon-Woo Kim ,  Sun-Ho Kim ,  Eung-Su Kim ,  Bo-Ra Yoon ,  Hyan-Jung Lee ,  Tae-Il Cho

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.