公开(公告)号：US10770337B2

公开(公告)日：2020-09-08

申请号：US15944909

申请日：2018-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Seung-Won Shin ,  Su-Ho Lee

IPC: B23P19/04 ,  H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  G03F7/20 ,  H01J37/32

Abstract: A lift pin assembly includes a lift pin having a first longitudinal axis substantially parallel with a first direction, a pin connection block combined with a lower end portion of the lift pin and including a first guide recess in a lower end portion of the pin connection block, the first guide recess extending in a second direction substantially perpendicular to the first direction, and a lift pin holder having a second longitudinal axis substantially parallel with the first direction and including a first sliding portion to be received movably in the second direction within the first guide recess by an eccentricity distance of the second longitudinal axis from the first longitudinal axis when the lift pin holder is connected to the lower end portion of the pin connection block.

公开(公告)号：US10665490B2

公开(公告)日：2020-05-26

申请号：US16240230

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Keon-Woo Kim ,  Sun-Ho Kim ,  Eung-Su Kim ,  Bo-Ra Yoon ,  Hyan-Jung Lee ,  Tae-Il Cho

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.

公开(公告)号：US20190080955A1

公开(公告)日：2019-03-14

申请号：US15944909

申请日：2018-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Seung-Won Shin ,  Su-Ho Lee

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67

Abstract: A lift pin assembly includes a lift pin having a first longitudinal axis substantially parallel with a first direction, a pin connection block combined with a lower end portion of the lift pin and including a first guide recess in a lower end portion of the pin connection block, the first guide recess extending in a second direction substantially perpendicular to the first direction, and a lift pin holder having a second longitudinal axis substantially parallel with the first direction and including a first sliding portion to be received movably in the second direction within the first guide recess by an eccentricity distance of the second longitudinal axis from the first longitudinal axis when the lift pin holder is connected to the lower end portion of the pin connection block.

公开(公告)号：US20200013657A1

公开(公告)日：2020-01-09

申请号：US16240230

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Keon-Woo Kim ,  Sun-Ho Kim ,  Eung-Su Kim ,  Bo-Ra Yoon ,  Hyan-Jung Lee ,  Tae-Il Cho

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.