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公开(公告)号:US10796883B2
公开(公告)日:2020-10-06
申请号:US16240178
申请日:2019-01-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jin-Ho Kim , Hyun-Bae Kim , Keon-Woo Kim , Gun-Woo Moon , Moo-Hyun Park , Jae-Il Baek
Abstract: A discrete capacitance switching circuit includes a DC decoupling capacitor connected between a power node that receives an AC signal and a first node, a diode connected between the first node and a second node, a unit capacitor connected between the second node and a reference node that receives a ground voltage, and a bias circuit. The bias circuit is configured to apply a first DC voltage to the first node and apply a second DC voltage to the second node. The applied first and second DC voltages control a switching operation of the diode.
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2.
公开(公告)号:US20200013657A1
公开(公告)日:2020-01-09
申请号:US16240230
申请日:2019-01-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ja-Woo Lee , Keon-Woo Kim , Sun-Ho Kim , Eung-Su Kim , Bo-Ra Yoon , Hyan-Jung Lee , Tae-Il Cho
IPC: H01L21/68 , H01J37/32 , H01L21/67 , H01L21/687 , H01L21/683
Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.
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3.
公开(公告)号:US10665490B2
公开(公告)日:2020-05-26
申请号:US16240230
申请日:2019-01-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ja-Woo Lee , Keon-Woo Kim , Sun-Ho Kim , Eung-Su Kim , Bo-Ra Yoon , Hyan-Jung Lee , Tae-Il Cho
IPC: H01L21/68 , H01J37/32 , H01L21/67 , H01L21/687 , H01L21/683
Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.
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