公开(公告)号：US20210366102A1

公开(公告)日：2021-11-25

申请号：US17102700

申请日：2020-11-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suhwan PARK ,  Namil Koo ,  Taeheung Ahn ,  Kwangjun Yoon ,  Jongmin Yoon ,  Ikseon Jeon ,  Jimin Choi

IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G06K9/46 ,  G06T7/13 ,  G06T7/70 ,  H01L21/67

Abstract: An inspection apparatus includes a measurement device disposed to be spaced apart from an upper surface of a wafer, an image capturing device configured to capture an image of at least a portion of the measurement device and at least a portion of the upper surface of the wafer, a memory storing an algorithm to measure a distance between the measurement device and the upper surface of the wafer based on the image, and a controller configured to measure the distance between the measurement device and the upper surface of the wafer based on the algorithm, wherein the image includes a measurement region in which the measurement device is displayed, a wafer region in which the wafer is displayed, and a reflective region in which the measurement device being reflected on the upper surface of the wafer is displayed, and wherein the wafer region and the reflective region overlap with each other.

公开(公告)号：US11688623B2

公开(公告)日：2023-06-27

申请号：US16834132

申请日：2020-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Racine Elysia Auxter Nassau ,  Namil Koo ,  Suhwan Park ,  Taeheung Ahn ,  Sangyeon Oh

IPC: H01L21/683 ,  H01L21/687 ,  G01N21/95

CPC classification number: H01L21/6838 ,  G01N21/9501 ,  H01L21/68714

Abstract: A wafer inspection apparatus includes a support structure including a frame and vacuum chucks mounted thereon, each vacuum chuck having a support surface including a vacuum suction portion, the support structure configured to structurally support a wafer on one or more vacuum chucks, the frame defining an opening larger than an area of the wafer. The wafer inspection apparatus includes an electromagnetic wave emitter configured to irradiate an inspection electromagnetic wave to the wafer, a sensor configured to receive the inspection electromagnetic wave from the wafer based on the inspection electromagnetic wave passing through the wafer, and a driver configured to move at least one of the electromagnetic wave emitter or the frame to change an irradiation location of the wafer. Each vacuum chuck is configured to be selectively movable between a first location and a second location in relation to the frame.