公开(公告)号：US20230080023A1

公开(公告)日：2023-03-16

申请号：US17897727

申请日：2022-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehwan JANG ,  Hyeokshin KWON ,  Jaeho SHIN

IPC: H01P7/06 ,  H01Q1/22 ,  G06N10/40

Abstract: A multi-mode resonator for a quantum computing element is included. In one general aspect, an apparatus including a multi-mode electromagnetic resonator includes a structure configured with a cavity therein that extends lengthwise in a first direction, the cavity including a first side surface and a second side surface facing each other, iris regions are at positions along the first direction on the first side surface of the cavity, the iris regions are arranged to overlap respective electromagnetic fields that form in the cavity in a target mode when electromagnetic energy is supplied to the cavity.

公开(公告)号：US20220149501A1

公开(公告)日：2022-05-12

申请号：US17515055

申请日：2021-10-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyeong LEE ,  Hyeokshin KWON ,  Jaeho SHIN ,  Taehwan JANG ,  Insu JEON

IPC: H01P3/00 ,  H01P7/08 ,  G06N10/00

Abstract: A qubit memory of a quantum computer is provided. The qubit memory according to an embodiment includes a first readout unit, a first transmon, and a first data storage unit storing quantum information, and the first data storage unit includes a first superconducting waveguide layer, an insulating layer, and a superconductor layer sequentially stacked on a substrate. In one example, the first superconducting waveguide layer may include a superconducting resonator.

公开(公告)号：US20230004849A1

公开(公告)日：2023-01-05

申请号：US17683797

申请日：2022-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehwan JANG ,  Jinhyoun KANG ,  Hyeokshin KWON ,  Jaeho SHIN ,  Jaehyeong LEE ,  Insu JEON ,  Sungho HAN

IPC: G06N10/40

Abstract: An active circulator includes: an active filter; and a power divider serially connected to the active filter, wherein three or more combinations of the active filter and the power divider are connected to form a loop.

公开(公告)号：US20160118721A1

公开(公告)日：2016-04-28

申请号：US14830335

申请日：2015-08-19

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chulsoon PARK ,  Hojung KIM ,  Hongyi KIM ,  Innyeal OH ,  Joongho LEE ,  Taehwan JANG

IPC: H01Q9/28

CPC classification number: H01Q9/28 ,  H01Q1/2283

Abstract: Provided are chip antennas for near field communication and methods of manufacturing the chip antennas. A chip antenna for near field communication includes a substrate; a first antenna element on the substrate; and a second antenna element on the first antenna element. The substrate, the first antenna element, and the second antenna element are included in a single chip. The first and second antenna elements are formed outside the chip. The substrate is a lower layer including a plurality of devices. The first antenna element is a metal structure having a fish bone shape. The second antenna element is a dipole antenna.

Abstract translation: 提供了用于近场通信的芯片天线和制造芯片天线的方法。 用于近场通信的芯片天线包括基板; 基板上的第一天线元件; 以及第一天线元件上的第二天线元件。 衬底，第一天线元件和第二天线元件包括在单个芯片中。 第一和第二天线元件形成在芯片外部。 衬底是包括多个器件的下层。 第一天线元件是具有鱼骨形状的金属结构。 第二天线元件是偶极天线。