公开(公告)号：US20240363989A1

公开(公告)日：2024-10-31

申请号：US18770206

申请日：2024-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyeong Lee ,  Hyeokshin Kwon ,  Jaeho Shin ,  Taehwan Jang ,  Insu Jeon

IPC: H01P3/00 ,  G06N10/00 ,  H01P7/08

CPC classification number: H01P3/003 ,  G06N10/00 ,  H01P7/086

Abstract: A qubit memory of a quantum computer is provided. The qubit memory according to an embodiment includes a first readout unit, a first transmon, and a first data storage unit storing quantum information, and the first data storage unit includes a first superconducting waveguide layer, an insulating layer, and a superconductor layer sequentially stacked on a substrate. In one example, the first superconducting waveguide layer may include a superconducting resonator.

公开(公告)号：US20220271212A1

公开(公告)日：2022-08-25

申请号：US17555812

申请日：2021-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehwan Jang ,  Hyeokshin Kwon ,  Jaeho Shin ,  Jaehyeong Lee ,  Insu Jeon ,  Sungho Han

IPC: H01L39/22 ,  H01L39/02 ,  G06N10/40

Abstract: A multi-mode resonator is provided. The multi-mode resonator includes a housing and a cavity disposed in the housing, wherein the cavity includes a main cavity and a plurality of first subcavities disposed on a first lateral side of the main cavity.

公开(公告)号：US12062826B2

公开(公告)日：2024-08-13

申请号：US17515055

申请日：2021-10-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyeong Lee ,  Hyeokshin Kwon ,  Jaeho Shin ,  Taehwan Jang ,  Insu Jeon

IPC: H01P3/00 ,  G06N10/00 ,  H01P7/08

CPC classification number: H01P3/003 ,  G06N10/00 ,  H01P7/086

Abstract: A qubit memory of a quantum computer is provided. The qubit memory according to an embodiment includes a first readout unit, a first transmon, and a first data storage unit storing quantum information, and the first data storage unit includes a first superconducting waveguide layer, an insulating layer, and a superconductor layer sequentially stacked on a substrate. In one example, the first superconducting waveguide layer may include a superconducting resonator.

公开(公告)号：US09755313B2

公开(公告)日：2017-09-05

申请号：US14830335

申请日：2015-08-19

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chulsoon Park ,  Hojung Kim ,  Hongyi Kim ,  Innyeal Oh ,  Joongho Lee ,  Taehwan Jang

IPC: H01Q1/38 ,  H01Q9/28 ,  H01Q1/22

CPC classification number: H01Q9/28 ,  H01Q1/2283

Abstract: Provided are chip antennas for near field communication and methods of manufacturing the chip antennas. A chip antenna for near field communication includes a substrate; a first antenna element on the substrate; and a second antenna element on the first antenna element. The substrate, the first antenna element, and the second antenna element are included in a single chip. The first and second antenna elements are formed outside the chip. The substrate is a lower layer including a plurality of devices. The first antenna element is a metal structure having a fish bone shape. The second antenna element is a dipole antenna.