公开(公告)号：US20230035240A1

公开(公告)日：2023-02-02

申请号：US17825508

申请日：2022-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongchoon PARK ,  Taewon SUN ,  Sangyong KIM ,  Bosung CHOI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.

公开(公告)号：US20220361334A1

公开(公告)日：2022-11-10

申请号：US17431900

申请日：2021-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taewon SUN ,  Jichul KIM ,  Kicheol BAE ,  Jinyong PARK ,  Jungje BANG ,  Yongjae SONG

IPC: H05K1/14 ,  H05K7/14 ,  H05K1/18 ,  H05K1/02 ,  H04M1/02

Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.