公开(公告)号：US20240357741A1

公开(公告)日：2024-10-24

申请号：US18640555

申请日：2024-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung CHUNG ,  Jinyong PARK ,  Chulwoo PARK ,  Yongjae SONG ,  Sangwon HA

IPC: H05K1/03

CPC classification number: H05K1/036 ,  H05K2201/0191 ,  H05K2201/0209

Abstract: An electronic device according to an embodiment of the disclosure may comprise: a housing and a printed circuit board disposed in the housing and comprising an alternately stacked plurality of insulation layers and plurality of conductive layers. The plurality of insulation layers may include at least one first insulation layer and at least one second insulation layer. The at least one first insulation layer may include a first insulator including a resin having a Tg value of 200 degrees or more and a filler having a content of 50% to 70%. The at least one second insulation layer may include a second insulator including a glass fiber.

公开(公告)号：US20240339391A1

公开(公告)日：2024-10-10

申请号：US18745592

申请日：2024-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunoh CHI ,  Sanghoon PARK ,  Wonseob KIM ,  Yongjae SONG ,  Kyungho LEE

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/14

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49838 ,  H05K1/14 ,  H05K2201/10378

Abstract: An electronic device according to various embodiments of the disclosure may include: a first printed circuit board; a second printed circuit board; and an interposer having one surface on which the first printed circuit board is disposed and the other surface on which the second printed circuit board is disposed, wherein the interposer includes: a first via including a first via hole and a first plating layer; a second via including a second via hole having a diameter being increased toward a direction getting away from the first via and a second plating layer coming in contact with the first plating layer, and disposed at one end of the first via; a third via hole having a diameter being increased toward the direction getting away from the first via and a third plating layer coming in contact with the first plating layer.

公开(公告)号：US20230388401A1

公开(公告)日：2023-11-30

申请号：US18328229

申请日：2023-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minuk KIM ,  Kyunggu KIM ,  Jihwan KIM ,  Kyungmoon SEOL ,  Yongjae SONG ,  Byungduk YANG ,  Kyungtae KIM ,  Kwangtai KIM ,  Donghyun YEOM ,  Jaebong CHUN

IPC: H04M1/02 ,  G09F9/30 ,  G06F1/16 ,  H01Q1/24

CPC classification number: H04M1/0268 ,  G09F9/301 ,  G06F1/1652 ,  H01Q1/243 ,  H05K1/189

Abstract: An electronic device may include a body having a cylindrical shape as a cylindrical housing. The body may include: a first side surface portion extending from one end; and a second side surface portion extending from the other end of the body and disposed in parallel with the first side surface portion. The body may include a rollable display disposed to be rolled in an inner space of the cylindrical housing, and pulled from the inside of the housing to the outside and pushed into the inside of the housing. The electronic device may include radio frequency (RF) transmission lines disposed to traverse an active area of the rollable display on the rear surface of the rollable display. The electronic device may include a plurality of antennas disposed on one side of the rollable display and electrically connected to a first side of the plurality of RF transmission lines. The electronic device may include a flexible circuit board electrically connected to a second side of the RF transmission lines.

公开(公告)号：US20220361334A1

公开(公告)日：2022-11-10

申请号：US17431900

申请日：2021-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taewon SUN ,  Jichul KIM ,  Kicheol BAE ,  Jinyong PARK ,  Jungje BANG ,  Yongjae SONG

IPC: H05K1/14 ,  H05K7/14 ,  H05K1/18 ,  H05K1/02 ,  H04M1/02

Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.

公开(公告)号：US20240337392A1

公开(公告)日：2024-10-10

申请号：US18744262

申请日：2024-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junggeon KIM ,  Hyunho KIM ,  Yongjae SONG ,  Kiseok KIM ,  Heedong NO ,  Duhan JUNG

IPC: F24F1/12 ,  F24F13/24

CPC classification number: F24F1/12 ,  F24F13/24 ,  F24F2013/242

Abstract: The present disclosure relates to a noise shielding device for implementing low noise in a heat pump outdoor unit of an air conditioning device (e.g. an air conditioner). The noise shielding device may comprise: a housing comprising a first surface exposed to the outside, open in the upward direction, and comprises a first sound insulating member comprising a sound insulating material in which a compressor is accommodated in an internal space thereof; and at least one first anti-vibration groove formed on the first surface of the first sound insulating member.

公开(公告)号：US20240310059A1

公开(公告)日：2024-09-19

申请号：US18671355

申请日：2024-05-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungjin YUN ,  Jeonguk KOH ,  Junggeon KIM ,  Kwangdeuk PARK ,  Woong SUN ,  Yongjae SONG ,  Kwangnam SHIN ,  Changsoo LIM

IPC: F24F1/16 ,  F24F1/08 ,  F24F1/46 ,  F25B40/02

CPC classification number: F24F1/16 ,  F24F1/08 ,  F24F1/46 ,  F25B40/02

Abstract: A heat exchanger assembly according to an example includes: a compressor configured to compress a refrigerant, a first heat exchanger configured to exchange heat between the refrigerant and a liquid, a subcooler configured to subcool the refrigerant, and a base supporting the compressor and the first heat exchanger, wherein the subcooler is supported on a side of the first heat exchanger.

公开(公告)号：US20220302722A1

公开(公告)日：2022-09-22

申请号：US17551793

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae PARK ,  Minki KIM ,  Kicheol BAE ,  Yongjae SONG ,  Hyelim YUN ,  Woosung JANG

IPC: H02J7/00 ,  H01Q7/00 ,  H02J50/10 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K5/00

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

公开(公告)号：US20210098911A1

公开(公告)日：2021-04-01

申请号：US17061461

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki KIM ,  Byunghoon LEE ,  Min PARK ,  Sungtae PARK ,  Jungmin PARK ,  Yongjae SONG ,  Hongshin SHIN ,  Woosung Jang ,  Chulwoo PARK ,  Chihyun CHO

IPC: H01R12/62 ,  H05K1/14

Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.

公开(公告)号：US20250063676A1

公开(公告)日：2025-02-20

申请号：US18937936

申请日：2024-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun LEE ,  Byeongkeol KIM ,  Sungjin KIM ,  Jaeyeon RA ,  Yongjae SONG ,  Jongmin JEON

IPC: H05K5/02 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14

Abstract: An electronic device comprises: a first housing; a second housing; a hinge structure comprising a hinge rotatably connecting the first housing with the second housing; and a substrate including a flexible portion, a rigid portion, and a stepped portion arranged at a boundary between the flexible portion and the rigid portion. The substrate comprises: a first conductive layer arranged in the flexible portion and the rigid portion; a first coating layer arranged on a portion of the first conductive layer corresponding to the rigid portion; a second conductive layer arranged on the first coating layer in the rigid portion; and a second coating layer arranged on the second conductive layer. A portion of the boundary of the first coating layer is aligned in the stepped portion.

公开(公告)号：US20230246395A1

公开(公告)日：2023-08-03

申请号：US18295467

申请日：2023-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juyoung LIM ,  Hyunwook NOH ,  Yongjae SONG ,  Inha LEE

IPC: H01R13/6582 ,  H01R12/71 ,  H01R12/79 ,  H01R13/6585

CPC classification number: H01R13/6582 ,  H01R12/716 ,  H01R12/79 ,  H01R13/6585 ,  H01R2201/00

Abstract: An electronic device is provided. The electronic device includes a housing, a first substrate arranged in an inner space of the housing and including at least one electrical element, at least one receptacle including a plurality of conductive terminals arranged to at least partially surround the at least one electrical element included in the first substrate, and at least one connector detachably coupled to the at least one receptacle and including a plurality of connector terminals, wherein at least one of the plurality of conductive terminals may be electrically connected to the ground of the first substrate.