公开(公告)号：US20190319381A1

公开(公告)日：2019-10-17

申请号：US16384465

申请日：2019-04-15

申请人： Samsung Electronics Co., Ltd.

发明人： Jungje BANG ,  Seungju KIM ,  Taewoo KIM ,  Bongkyu MIN ,  Bongchoon PARK ,  Jonggu PARK ,  Jonghan PARK ,  Jinyong PARK ,  Hoyeon SEO ,  Jaeheung YE ,  Hyelim YUN ,  Hyeongju LEE ,  Hyoungsoo JUNG

IPC分类号： H01R12/71 ,  H01R13/41 ,  H01R13/6596 ,  H05K7/14 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02

摘要： An electronic device includes a housing, a first board disposed inside the housing and including a first signal line and a first ground, a second board disposed on the first board and including a second signal line and a second ground, a plurality of connectors interposed between the first board and the second board, and a first electronic component disposed inside a space defined by the first board, the second board, and the plurality of connectors. Each of the plurality of connectors includes an insulating member, at least one conductive pin having at least a portion surrounded by the insulating member, and a metal plate electrically connecting the first ground of the first board with the second ground of the second board and formed on an outer sidewall of the insulating member. A first signal pin of conductive pins included in the plurality of connectors electrically connects the first signal line of the first board and the second signal line of the second board with the first electronic component. The first electronic component is electrically shielded against an outside of the space by the first ground of the first board, the second ground of the second board, and the metal plate.

公开(公告)号：US20230035240A1

公开(公告)日：2023-02-02

申请号：US17825508

申请日：2022-05-26

申请人： Samsung Electronics Co., Ltd.

发明人： Bongchoon PARK ,  Taewon SUN ,  Sangyong KIM ,  Bosung CHOI

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18

摘要： An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.

公开(公告)号：US20210099560A1

公开(公告)日：2021-04-01

申请号：US16985516

申请日：2020-08-05

申请人： Samsung Electronics Co, Ltd.

发明人： Taewoo KIM ,  Dui KANG ,  Bongkyu MIN ,  Bongchoon PARK ,  Sanghoon PARK ,  Jinyong PARK ,  Hyelim YUN ,  Hyeongju LEE ,  Younoh CHI

IPC分类号： H04M1/02 ,  H05K1/11 ,  H05K1/18

摘要： An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.