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公开(公告)号：US20240196517A1
公开(公告)日：2024-06-13
申请号：US18585714
申请日：2024-02-23
发明人： Youngsun JO , Dohoon KIM , Sangyong KIM , Bongkyu MIN , Seoyoung PARK , Yunoh CHI
CPC分类号： H05K1/0219 , H05K1/116 , H05K1/14 , H05K2201/0939 , H05K2201/10378
摘要： Disclosed is an electronic device. The electronic device includes: a housing, a first board and a second board disposed in an interior of the housing, and an interposer electrically connecting the first board and the second board, the interposer includes a first part that defines an outer surface thereof, and a second part that defines an inner surface thereof, vias included in the first part are all ground vias and are spaced apart from each other by a first interval, and the vias included in the second part include signal vias, and ground vias, the number of which is less than that of the signal vias, and may be spaced apart from each other by a second interval that is larger than or equal to the first interval.
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公开(公告)号：US20230231026A1
公开(公告)日：2023-07-20
申请号：US17890547
申请日：2022-08-18
发明人： Seungkyu KIM , Yonghee PARK , Dong-Gwan SHIN , Dae Sin KIM , Sangyong KIM , Joohyung YOU
IPC分类号： H01L29/423 , H01L29/66 , H01L29/786 , H01L29/08
CPC分类号： H01L29/42392 , H01L29/6656 , H01L29/78696 , H01L29/0847
摘要： A semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern and including semiconductor patterns vertically stacked and spaced apart from each other, a source/drain pattern connected to the semiconductor patterns, a gate electrode on the semiconductor patterns and extending in a first direction, and a gate insulating layer between the semiconductor patterns and the gate electrode. A first semiconductor pattern of the semiconductor patterns includes opposite side surfaces in the first direction, and bottom and top surfaces. The gate insulating layer covers the opposite side surfaces, and the bottom and top surfaces and includes a first region on one of the opposite side surfaces of the first semiconductor pattern and a second region on one of the top or bottom surfaces of the first semiconductor pattern, and a thickness of the first region may be greater than a thickness of the second region.
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3.发明申请公开(公告)号：US20170115713A1
公开(公告)日：2017-04-27
申请号：US15331144
申请日：2016-10-21
发明人： Jaeyoung SHIN , Woongeun KWAK , Sangyong KIM , Jinwoo KIM , Jungsik PARK , Seungwon OH , Byounguk YOON , Sehwan CHOI , Hyunju HONG
CPC分类号： G06F1/266 , G06F1/1632 , G06F1/1686 , G06F1/3296 , G06F3/017 , G06F3/03545 , G06F2200/1632 , G06F2200/1633 , H02J7/0029 , H02J7/0047 , H02J7/025 , H02J50/10 , H02J2007/0039 , H04W52/028 , Y02D70/1242 , Y02D70/1262 , Y02D70/1264 , Y02D70/142 , Y02D70/144 , Y02D70/164 , Y02D70/166 , Y02D70/168 , Y02D70/26
摘要： Provided are an electronic device and method for controlling functions of the electronic device according to attachment of an external device. The electronic device includes an interface part that electrically contacts an external device, and a processor that determines, when an external device is electrically connected, whether the external device has a second power source, and controls usage of a first power source of the electronic device according to a result of the determination.
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公开(公告)号：US20230035240A1
公开(公告)日：2023-02-02
申请号：US17825508
申请日：2022-05-26
发明人： Bongchoon PARK , Taewon SUN , Sangyong KIM , Bosung CHOI
摘要： An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.
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