公开(公告)号：US20240088200A1

公开(公告)日：2024-03-14

申请号：US18321817

申请日：2023-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeewoong Kim ,  Hojun Kim ,  Taiko Yamaguchi

IPC: H01L27/08 ,  H01F27/28 ,  H01F27/29 ,  H01L23/522 ,  H01L23/58

CPC classification number: H01L28/10 ,  H01F27/2804 ,  H01F27/29 ,  H01L23/5227 ,  H01L23/585

Abstract: An integrated circuit including an inductive element according to some embodiments is provided. The inductive element includes a first through electrode extending in a first direction that is perpendicular to a substrate (e.g., an upper surface of the substrate), an upper metallization pattern connected to the first through electrode and extending in a second direction that is perpendicular to the first direction, and a lower metallization pattern connected to the first through electrode and extending in the second direction, wherein the upper metallization pattern and the lower metallization pattern are spaced apart from each other with the first through electrode therebetween.