公开(公告)号：US09773752B2

公开(公告)日：2017-09-26

申请号：US15221164

申请日：2016-07-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-hyun Baik ,  Cheol-woo Lee ,  Wan-ho Park

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0652 ,  H01L23/3128 ,  H01L24/06 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2924/15192 ,  H01L2924/15311

Abstract: A printed circuit board (PCB) for reducing a size of a semiconductor package and a semiconductor package including the same are provided. The PCB includes a substrate base including a chip attach area disposed on a top thereof, a top pad and a bottom pad respectively disposed on the top and a bottom of the substrate base, a first top solder resist layer formed on the top of the substrate base and including a first pad opening corresponding to the top pad and covering the chip attach area, a second top solder resist layer formed on the first top solder resist layer and including a second pad opening corresponding to the top pad and a chip attach opening corresponding to the chip attach area, and a bottom solder resist layer formed on the bottom of the substrate base and including a third pad opening corresponding to the bottom pad.